Model & package intelligence
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ST MM3Z3V6 Zener diode MM3Z3V6
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST MM3Z3V6
- Type
- ST
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- MM3Z3V6
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.223g
- Electronic Component
- 1
- (Zzt)
- 130Ω
- Electronic Component
- BM0226463841
- Diode
- 1
- Current(Ir)
- 10uA@1V
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- 3.4V~3.8V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MM3Z3V6 产品概述
一、简介
MM3Z3V6 是一款独立式小功率稳压二极管，标称稳压值为 3.6V（允许范围 3.4V~3.8V），由 ST（先科）提供，采用 SOD‑323 表面贴装封装。该器件以体积小、成本低、易于安装为特点，适用于便携式和空间受限的电子设备中作为基准电压源、过压钳位或杂散电流泄放元件。
二、主要参数
- 稳压值（标称）：3.6V；范围：3.4V ~ 3.8V
- 反向电流 Ir：10 μA @ 1V（说明：在指定电压条件下的反向泄漏电流）
- 耗散功率 Pd：300 mW（最大，受环境温度和 PCB 散热影响需降额使用）
- 阻抗 Zzt：130 Ω（动态阻抗，说明在测试电流下的增量电阻特性）
- 封装：SOD‑323（小型表贴，适合自动贴装与回流焊）
三、应用场景
- 低功耗参考电压源：在电流较小的偏置条件下可提供稳定的 3.6V 参考。
- 电源过压/浪涌钳位：保护后续器件免受瞬间过压冲击。
- 信号线/接口保护：作为防止电压尖峰进入敏感电路的保护元件。
- 便携式与消费类电子：体积受限且对功耗敏感的应用中广泛使用。
四、典型电路与使用要点
- 恒流偏置：稳压二极管需配合限流电阻工作，推荐根据输入电压和所需稳压电流计算限流电阻值，并保证在最高输入条件下功耗不超 Pd。
- 动态阻抗影响：Zzt = 130 Ω 表明在较大电流变化时输出电压会有明显摆动，若需更低噪声或更高稳压精度，应提高工作电流至器件规定的测试电流范围或选用低阻抗替代品。
- 泄漏电流考量：Ir = 10 μA 在高阻抗测量或待机电路中不可忽视，需评估对系统待机功耗和测量精度的影响。
五、封装与热管理
SOD‑323 为小型表贴封装，适配常用贴片工艺与回流温度曲线。由于器件最大耗散功率仅 300 mW，热阻较高，实际功耗能力受 PCB 铜箔面积和焊盘设计影响显著。建议在电路板上为稳压二极管提供适度的铜箔散热区域，必要时进行功率降额或使用并联/替代器件以保证可靠性。
六、选型建议与注意事项
- 在选择时确认测试电流及温度系数，若对稳压精度要求高，应查看完整数据手册中 Izt、Vz 温漂等参数。
- 注意最大反向电压和瞬态能力，必要时在前端增加串联限流或吸收元件。
- 生产与装配时遵循 SOD‑323 的焊接建议，避免过热或湿度引起的焊接缺陷。
- 对待机电流敏感的系统应评估 10 μA 的泄漏是否可接受，否则考虑选用低漏电型号。
总结：MM3Z3V6 以其小尺寸和 3.6V 稳压特性，适合用于低功耗小空间的稳压和保护场合。但因动态阻抗和功耗限制，设计时需重视工作电流、热管理与漏电流对系统性能的影响，必要时参考完整数据手册以完成最终设计验证。
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