WMSIC Electronic Components

ST 2SB772PU transistor 2SB772PU

Model2SB772PU
PackageSOT-89
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST 2SB772PU
Type
ST
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
2SB772PU
Electronic Component
1
Package
SOT-89
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.146g
Electronic Component
1
Electronic Component
BM0228980554
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
80MHz
Power Dissipation(Pd)
10W
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SB772PU 产品概述

1. 产品简介

2SB772PU 是一款由 ST(先科)公司生产的 PNP 型双极结型晶体管(BJT),采用 SOT-89-3 封装。该晶体管设计用于中功率放大和开关应用,具有高电流承载能力和良好的热性能。其最大集电极电流(Ic)为 3A,集射极击穿电压(Vceo)为 30V,最大功耗(Pd)为 1W,适用于多种电子电路设计。

2. 主要特性

  • 晶体管类型: PNP
  • 最大集电极电流 (Ic): 3A
  • 集射极击穿电压 (Vceo): 30V
  • 最大功耗 (Pd): 1W
  • 封装类型: SOT-89-3
  • 品牌: ST(先科)

3. 应用领域

2SB772PU 广泛应用于各种电子设备中,包括但不限于:

  • 电源管理: 用于开关电源、线性稳压器等。
  • 音频放大: 适用于音频放大器的输出级。
  • 电机驱动: 用于小型电机的驱动电路。
  • 信号处理: 用于信号放大和开关电路。

4. 封装与引脚配置

2SB772PU 采用 SOT-89-3 封装,这是一种表面贴装封装,具有三个引脚。引脚配置如下:

  • 引脚 1 (Emitter): 发射极
  • 引脚 2 (Base): 基极
  • 引脚 3 (Collector): 集电极

5. 电气特性

  • 集电极-发射极饱和电压 (Vce(sat)): 典型值为 0.3V @ Ic=1A, Ib=0.1A
  • 直流电流增益 (hFE): 典型值为 100 @ Ic=1A, Vce=5V
  • 截止频率 (fT): 典型值为 100MHz

6. 热特性

  • 热阻 (RthJA): 典型值为 125°C/W
  • 最大结温 (Tj): 150°C

7. 可靠性与环境特性

  • 工作温度范围: -55°C 至 +150°C
  • 储存温度范围: -55°C 至 +150°C
  • 湿度敏感性等级 (MSL): 1 (无限制)

8. 设计考虑

在设计使用 2SB772PU 的电路时,应考虑以下因素:

  • 散热: 由于最大功耗为 1W,建议在设计中加入适当的散热措施,如散热片或增加 PCB 铜箔面积。
  • 电流限制: 确保集电极电流不超过 3A,以避免器件损坏。
  • 电压限制: 集射极电压不应超过 30V,以防止击穿。

9. 替代型号

如果需要替代型号,可以考虑以下具有相似特性的晶体管:

  • 2SB772: 类似规格的 PNP 晶体管,但封装可能不同。
  • BC327: 另一款 PNP 晶体管,具有类似的电流和电压特性。

10. 结论

2SB772PU 是一款性能可靠、应用广泛的 PNP 型晶体管,适用于多种电子电路设计。其高电流承载能力和良好的热性能使其成为中功率放大和开关应用的理想选择。通过合理的设计和散热措施,可以充分发挥其性能,确保电路的稳定性和可靠性。

11. 参考资料

  • ST 公司官方网站
  • 2SB772PU 数据手册
  • 相关电子元器件手册和设计指南

通过以上概述,您可以全面了解 2SB772PU 的特性、应用和设计考虑,为您的电子设计提供有力支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.