WMSIC Electronic Components

ST BZX84C6V2 Zener diode BZX84C6V2

ModelBZX84C6V2
PackageSOT-23
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST BZX84C6V2
Type
ST
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
BZX84C6V2
Electronic Component
1
Package
SOT-23
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzt)
10Ω
Electronic Component
BM0226873825
Diode
1
Current(Ir)
3uA@4V
Power Dissipation(Pd)
350mW
Electronic Component
5.8V~6.6V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX84C6V2 稳压二极管(ST/先科)产品概述

一、产品简介

BZX84C6V2 为独立式(离散)硅稳压二极管,标称稳压值 6.2V,常用于小功率电压参考、保护和基准电路。器件由 ST(先科)生产,封装为 SOT-23,适配表面贴装工艺,体积小、可靠性高,适合消费电子与工业控制中的低功耗稳压与钳位场景。

二、主要参数

  • 标称稳压:6.2V;规范范围:5.8V ~ 6.6V。
  • 反向漏电流 Ir:3 μA @ 4V。
  • 动态阻抗 Zzt:约 10 Ω(测试条件请参照器件数据手册)。
  • 最大耗散功率 Pd:350 mW(在规定散热条件下)。
  • 工作结温范围:-65 ℃ ~ +150 ℃。
  • 封装:SOT-23(3 引脚,常作单只二极管封装使用)。

三、典型应用

  • 作为低功耗的基准电压源或参照器件;
  • 电压钳位与浪涌保护,限制过压瞬态;
  • 负载开关或分压电路的稳压单元;
  • 传感器接口与信号调理中作为简单的参考/保护元件。

四、使用与设计注意

  • 最大稳压耗散 Pd=350 mW,对应理论最大稳压电流 Iz(max)≈350mW/6.2V≈56 mA,但在 SOT-23 封装及实际散热条件下应做降额处理,常规工作电流建议选在几 mA 至几十 mA 范围内(视散热及寿命要求)。
  • 设计串联限流电阻 Rs 时,按最小输入电压 Vin_min 计算:Rs = (Vin_min − Vz) / (Iz + Il),其中 Il 为负载电流,Iz 为稳压工作电流。
  • 注意反向漏电随温度上升而增大,低电流微分测量或高精度参考场合需留意温漂与漂移。
  • 动态阻抗 Zzt 会影响负载调节性能,负载突变时输出电压会有短时偏差。

五、封装与散热管理

SOT-23 为小型塑封,热阻相对较大,热量主要通过引脚和 PCB 铜箔散出。实际电路布局应增大焊盘铜量、增加散热过孔并避免器件被连续高功率工作。高温环境需按芯片结温上限(+150 ℃)及热阻进行功率降额。

六、替代与选型建议

BZX84 系列有多种标称电压,可按系统电压与精度需求选择相邻电压型号。选择时关注稳压容差、动态阻抗、漏电与封装散热能力。若需更高功率或更低动态阻抗,可考虑更大封装或专用稳压芯片。

七、可靠性与存储

遵循常规半导体元件存储与回流焊温度曲线要求,避免长时间潮湿环境存放。出厂前请参考 ST(先科)数据手册以获取完整电气特性曲线与可靠性试验数据,确保在目标应用条件下满足温漂、寿命与机械应力要求。

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