Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST 1N4736APF Zener diode 1N4736APF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST 1N4736APF
- Type
- ST
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- 1N4736APF
- Electronic Component
- 1
- Package
- DO-41
- Electronic Component
- Zener Diode
- Electronic Component
- 0.225g
- Electronic Component
- 1
- (Zzk)
- 700Ω
- (Zzt)
- 3.5Ω
- Electronic Component
- BM0264936447
- Diode
- 1
- Current(Ir)
- 10uA@4V
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 6.46V~7.14V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1N4736APF稳压二极管产品概述
一、产品核心定位与应用场景
1N4736APF是ST（先科）推出的通用型硅稳压二极管，核心功能为反向击穿稳压，标称稳压值6.8V，属于中低电压稳压器件范畴。该产品针对消费电子、工业控制、汽车电子等领域的通用稳压需求设计，适用于电源电路稳压、过压保护、基准电压源等典型场景，可有效稳定电路电压、抑制波动，保护敏感电子元件（如MCU、传感器）。
二、关键电气参数详解
该产品的核心参数直接决定应用性能，具体解析如下：
- 稳压值特性：标称稳压值6.8V，稳压范围6.46V~7.14V，对应精度±5%（6.8V×5%=0.34V），满足大多数通用电路的稳压需求，无需额外精密稳压电路；
- 反向漏电流：反向电流Ir=10μA（@4V反向电压），漏电流极低，待机/低功耗场景下可减少额外损耗，提升电路能效；
- 最大耗散功率：Pd=1W，是持续承受的最大功耗。结合稳压值计算，最大稳压电流Izmax≈147mA（1W÷6.8V），支持中等功率稳压应用；
- 动态阻抗：测试电流下的Zzt=3.5Ω（低阻抗，抑制电压随电流波动），低电流下的Zzk=700Ω（适配小负载场景），覆盖不同工况的稳压需求。
三、封装与可靠性特点
- 封装形式：采用DO-41直插封装，引脚间距符合行业标准，安装便捷，兼容通孔焊接工艺，适配多数PCB设计；
- 环保特性：无铅工艺制造，符合欧盟RoHS 2.0、中国GB/T 26572等环保法规，无铅无卤，可用于出口或高环保要求产品；
- 可靠性设计：DO-41封装散热良好，可有效散发布1W功耗；工作温度范围（典型-55℃~150℃）覆盖工业/商业级应用，抗冲击、抗振动能力符合行业标准，适合恶劣环境长期运行。
四、品牌与合规性说明
该产品由ST（先科）生产，先科作为国内知名半导体厂商，拥有成熟工艺与严格质量管控，产品一致性、可靠性经市场验证。此外，1N4736APF通过行业通用电气测试与环保认证，可直接用于各类电子设备设计，无需额外适配。
五、典型应用示例
- 开关电源反馈稳压：在12V开关电源反馈回路中并联该器件，配合运放调整输出，稳定目标电压；
- USB接口过压保护：在USB Type-C接口并联，过压（>6.8V）时击穿导通，钳位电压保护后端MCU/充电IC；
- 单片机ADC基准：外接至51单片机/STM32的VREF+引脚，提供稳定6.8V基准，提升ADC采样精度。
该产品凭借稳定的稳压性能、通用封装与可靠质量，成为电子设计中常用的稳压/保护器件，适配多场景需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
