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ST MB6S bridge rectifier MB6S
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST MB6S
- Type
- ST
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- MB6S
- Electronic Component
- 1
- Package
- MBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.151g
- Electronic Component
- 1
- Electronic Component
- BM0230692712
- Current
- 500mA
- Current(Ir)
- 5uA@600V
- (Vf)
- 1V@500mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MB6S 产品概述
一、产品简介
MB6S 是一款单相整流桥，来自 ST（先科）系列，采用 MBS 小型塑封封装，面向体积受限且对可靠性有一定要求的小功率整流场合。该器件强调低正向压降与高耐压特性，适合用于家电控制板、小型开关电源和通用整流用途。
二、主要参数
- 典型正向压降 Vf：1.0 V @ IF = 500 mA
- 额定直流反向耐压 Vr：600 V
- 额定整流电流（平均值）IF(AV)：500 mA
- 反向漏电流 Ir：≤ 5 μA @ VR = 600 V（常温）
- 非重复峰值浪涌电流 Ifsm：30 A（单次浪涌、窄脉冲）
- 工作结温范围：-55 ℃ ~ +150 ℃
（注意：资料中有时见到 “800 mA” 的标注，使用时请以厂方数据手册对平均整流电流和瞬态能力的具体说明为准）
三、电气与热特性要点
- 正向压降与耗散：在 500 mA 条件下约 1 V，连续工作时会产生热量，需关注功率耗散与结温上升。
- 反向漏流随温度显著增加，高温下应考虑泄漏电流对电路偏流和待机功耗的影响。
- Ifsm = 30 A 表明器件能承受短时高峰浪涌（如电源启动或充电电容时），但不可作为长时间工作指标，需配合限流或浪涌保护器件。
四、典型应用场景
- 小型线性或开关电源的整流输出
- 控制器、电机驱动板的交流整流与反向保护
- LED 驱动与照明电源（低电流场合）
- 测量与传感电路的半波/全波整流
五、选型与设计建议
- 按平均整流电流 500 mA 进行热设计并留有裕度，若电路可能出现较长时间的高负载，应采用更大额定电流的桥堆或加装散热方案。
- 对于含大电容的滤波网络，应计算充电浪涌并配限流电阻、NTC 或熔断保护以避免超出 Ifsm 限值。
- 若电路对漏电流敏感（例如高阻输入或精密测量），需考虑器件在最高工作温度下的 Ir 增加，并在必要时选择漏电更低的型号。
- 在高压侧应注意爬电距离与绝缘要求，保持 PCB 布局和间距满足 600 V 级别安全规范。
六、封装与安装注意
MBS 塑封桥堆体积小、安装方便，常用于直接插装或通过焊点固定在 PCB 上。焊接时注意避免过热以免影响封装机械强度；布局上应留出散热面积并靠近热源/热吸收区域布置以利散热。
七、可靠性与环境适应
- 工作结温范围宽（-55 ℃ ~ +150 ℃），适应工业级温度环境。
- 长期在高温、高湿或振动环境下使用时，应按应用场景做额外可靠性验证与筛选。
- 推荐按厂方数据手册的储存与回流焊工艺规范操作，以保证寿命与性能一致性。
结语：MB6S 以其高耐压、低正向压降及小体积的组合，适合中低功率的整流应用。实际选型与可靠性验证应结合具体工作电流、温度条件及突发浪涌水平，遵循厂方数据手册进行设计与热管理。若需更详细的引脚尺寸、典型特性曲线或过流、过热保护建议，可提供进一步的电路方案参考。
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