Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST MMBT9012H transistor MMBT9012H
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST MMBT9012H
- Type
- ST
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- MMBT9012H
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0264773790
- Transistor Type
- PNP
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 500mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT9012H 产品概述
一、产品简介
MMBT9012H 是 ST（先科）推出的一款小信号 PNP 晶体管，采用 SOT-23 小型封装，适用于便携与板载电路的通用放大与开关场合。器件具有低漏电、较高特征频率和中等电流能力，适合在低功耗、小尺寸产品中作为高端侧开关与小信号放大使用。
二、主要参数
- 晶体管类型：PNP
- 集射极击穿电压 Vceo：30 V
- 集电极电流 Ic（最大）：500 mA（受热度与耗散限制）
- 集电极截止电流 Icbo：100 nA（典型/最大量级）
- 特征频率 fT：100 MHz（高频响应良好）
- 射基极击穿电压 Vebo：5 V
- 最大耗散功率 Pd：200 mW（SOT-23 封装条件下）
三、性能特点
- 漏电低：Icbo ~100 nA，在高阻抗输入或偏置电路中有利于降低失效误差。
- 频率响应好：fT ≈100 MHz，适合高频小信号放大与切换。
- 小封装、高集电极电流能力：SOT-23 封装便于表面贴装，允许短时大电流驱动（但连续功率受 Pd 限制）。
- 低压控制：基极-发射极正向电压约为 0.6–0.9 V，便于与低压逻辑电平接口。
四、典型应用
- 电池供电设备中的高端侧开关与负载断开。
- 小信号放大器、前置放大和低功耗音频电路。
- 逻辑电平位移、驱动小型继电器或光电隔离器（注意功耗匹配）。
- 通用开关元件与保护电路。
五、使用与设计注意事项
- 功耗与电流限制：SOT-23 的 Pd 为 200 mW，在 Ic = 500 mA 时若 VCE 有较大压降会超出耗散上限（P = VCE × IC）。必须确保在连续工作下 VCE 极小或采用脉冲工作、良好 PCB 散热，以防过热损坏。
- 反向 Vebo：基极相对于发射极的反向电压不可超过 5 V，避免基极-发射极结反向击穿。
- 偏置设计：为保证稳定工作点，建议在基极加限流电阻并考虑温漂对 VBE 的影响。
- 引脚与封装：不同厂家封装引脚编号可能有差，电路接入前请参照具体器件数据手册确认引脚排列与封装标识。
六、封装与可靠性
SOT-23 小封装体积小，便于高密度贴装，但热阻较大，热设计需靠 PCB 铜箔和散热层辅助。器件在焊接时建议采用符合无铅工艺的回流温度曲线，避免超时高温导致性能退化。器件通常有 ESD 敏感，包装与使用时应采取防静电措施。
七、选型建议
在选型时若需更高连续功耗或更低 VCE 饱和，应考虑更大封装或功率晶体管；若需要 NPN 对应型号，可选择规格相近的 NPN 小信号管作为互补器件。最终设计以原厂数据手册的典型曲线与极限参数为准。
如需原厂数据表、引脚图或温度特性曲线，可进一步索取 MMBT9012H 详细数据手册以完成电路验证与热设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
