Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST BAT54A-HAF Schottky diode BAT54A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST BAT54A-HAF
- Type
- ST
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- BAT54A-HAF
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0257710338
- Current
- 300mA
- Diode
- 1
- Current(Ir)
- 2uA@25V
- (Vf)
- 800mV@100mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54A-HAF 产品概述
一、产品简介
BAT54A-HAF 是一款由 ST（先科）提供的 SOT-23 封装肖特基势垒二极管，属于小信号低压肖特基家族。器件具有低正向压降、快速开关特性和较小的反向漏电流，适合用于低电压、高效率的整流、保护与整列电路。基础参数：直流反向耐压 Vr = 30 V，整流电流 If = 300 mA，25℃ 下反向电流 Ir = 2 μA（@25 V），工作结温范围 -55℃ ～ +150℃，非重复峰值浪涌电流 Ifsm = 600 mA。封装为 SOT-23，便于表面贴装与自动化生产。
二、主要特性
- 低正向压降：减少整流与切换损耗，提高系统效率（适用于低压电源与电池供电设计）。
- 低反向漏流：典型 2 μA（25 V），在静态待机或高阻抗节点能降低泄漏功耗。
- 宽温度范围：-55℃ 到 +150℃，适合工业级与汽车电子（非安全关键）环境下工作。
- 小型封装：SOT-23 占板面积小，适合空间受限的便携式与消费电子产品。
- 良好的浪涌承受能力：Ifsm = 600 mA，可抵御短时非重复浪涌。
三、典型应用场景
- 低压整流与电源二次侧保护（如便携设备充放电路径）。
- 反向极性保护与线路防护（低压模块、接口防反接）。
- 快速开关与钳位电路（开关电源、DC-DC 转换器辅助回路）。
- 信号整形与电平移位（高频小信号路径、检波电路）。
- 表面贴装应用中替代普通硅二极管以减少压降与热耗。
四、封装与可靠性注意事项
- SOT-23 为三引脚小型封装，安装时注意焊盘热量管理与回流曲线，HAF 后缀常与环保与封装特性相关（例如无卤/无铅工艺），具体请以厂商正式资料为准。
- 封装热阻与 PCB 铜箔面积直接影响允许通过的持续电流：虽名义整流电流为 300 mA，实际布局中应按温升、铜厚与散热条件适当降额使用。
- Ifsm 为非重复峰值浪涌能力，具体测试条件（波形与时间）请参考数据表，不宜作为连续过载使用依据。
五、设计与选型建议
- 若要求更低漏电或更高电流能力，可参考同家族其他型号并比较 Vr、Ir 与 If 参数。
- 在电源路径上做浪涌保护时，配合合适的限流电阻或热熔断元件，避免重复超过 Ifsm。
- 对静态功耗敏感的系统（如电池供电），应重点考虑温度对 Ir 的影响并进行温度场景评估。
- 生产与可靠性验证阶段，应参照 ST 官方数据表与封装资料，完成热仿真与温升测试。
六、结语
BAT54A-HAF 以其低压降、低漏电与小体积的特性，在便携、接口保护与低压整流场景中具有良好性价比。选型时请以厂商数据表为准，结合 PCB 布局与工作环境进行热管理与电气降额，以获得最佳可靠性与性能表现。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
