Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ST CS1C470M-CRD54 aluminum electrolytic capacitor
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST CS1C470M-CRD54
- Type
- ST
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- CS1C470M-CRD54
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- SMD,D5xL5.4mm
- Electronic Component
- SMD Aluminum Electrolytic Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.36g
- Electronic Component
- 1
- Electronic Component
- BM0210348961
- Electronic Component
- 1000hrs@105℃
- Operating Temperature
- 40℃~+105℃
- Voltage
- 16V
- Capacitor
- 5mm
- Capacitor
- 5.4mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CS1C470M-CRD54 产品概述
CS1C470M-CRD54 是先科（ST）出品的一款贴片铝电解电容，采用紧凑的 SMD 封装（D5 × L5.4mm），额定电压 16V，容值 47µF，容差 ±20%。该型号针对消费电子与工业控制中对体积、温度与寿命有均衡要求的电源去耦和滤波场合进行了优化。
一、主要规格参数
- 品牌：ST（先科）
- 型号：CS1C470M-CRD54
- 容值：47µF ±20%
- 额定电压：16V DC
- 工作温度范围：-40℃ ~ +105℃
- 工作寿命：1000 小时 @ 105℃
- 外形尺寸（电容体）：直径 5.0mm × 长度 5.4mm
- 封装形式：SMD（贴片式）
二、主要特性
- 体积小、容量相对较大，适合空间受限的应用板面布局。
- 宽温度范围（-40℃ 至 +105℃），适应室温及轻工业环境。
- 1000 小时 @ 105℃ 的寿命等级，满足多数中短期可靠性要求。
- 标称容差 ±20%，常用于电源旁路、滤波等对精度要求不高的场合。
- SMD 封装便于自动化贴装与回流焊工艺，提高产线效率。
三、典型应用
- 开关电源与线性稳压器的输入/输出滤波与去耦；
- MCU、电源管理芯片的去耦与旁路；
- 工业控制模块与消费电子设备的局部电源滤波；
- 体积受限的便携设备与通讯终端电源回路。
四、封装与可靠性说明
- 本型号为 D5×L5.4mm 贴片铝电解构造，适合标准贴片流程与卷带（Tape & Reel）供料。
- 在高温环境下（接近 105℃）连续工作会影响寿命，设计留有余量可提升长期可靠性。
- 推荐在 PCB 布局时为电容留出散热与伸缩空间，减小应力集中。
五、使用与焊接建议
- 采用适配的回流焊曲线与合格的无铅或有铅锡膏工艺，避免超时高温冲击；
- 回流焊后建议进行目视与波形检测，确认极性与焊点良好；
- 存储时应避免潮湿与高温，按照一般电解电容器储存规范处理。
六、订购信息
- 订购型号：CS1C470M-CRD54（ST/先科）
- 在选型阶段请参阅厂家详细数据手册获取 ESR、纹波电流、等效串联电感（ESL）及回流焊推荐曲线等完整参数，以确保满足特定应用需求。
如需我帮您核对与其它同尺寸或不同寿命/电压等级的替代型号对比，或提供 PCB 布局及去耦网络建议，可继续告诉我您的应用场景与设计要求。
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