WMSIC Electronic Components

ST 1SS181 diode 1SS181

Model1SS181
PackageSOT-23
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST 1SS181
Type
ST
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
1SS181
Electronic Component
1
Package
SOT-23
Electronic Component
Switch Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0257710336
Current
100mA
Diode
1
Current(Ir)
500nA@80V
(Vf)
1.2V@100mA
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SS181 产品概述

一、简介

1SS181 是一款双二极管、共阳极(共阳)配置的高速开关二极管,封装为 SOT-23,品牌为 ST(先科)。器件以其较高的反向耐压(80V)、快速反向恢复(Trr 4ns)和低静态漏电流(Ir 500nA@80V)为特点,适合用于高速信号整流、保护与切换场合。

二、主要电气参数

  • 二极管配置:1对共阳极(两个二极管共阳)
  • 正向压降:Vf = 1.2V @ IF = 100mA
  • 直流反向耐压:Vr = 80V
  • 整流电流(平均正向电流):IF = 100mA
  • 耗散功率:Pd = 350mW
  • 反向电流:Ir = 500nA @ 80V
  • 反向恢复时间:Trr = 4ns(高速切换特性)
  • 非重复峰值浪涌电流:Ifsm = 2A
  • 封装:SOT-23(小外形,适合集成于表贴电路板)

三、性能特点与应用价值

1SS181 在小体积条件下兼顾了较高电压耐受和快速开关能力,适合以下场景:

  • 高速信号整流与开关:4ns 的反向恢复时间使其可应用于几十MHz 级别的高速逻辑与开关电路。
  • 钳位与防反接保护:80V 的反向耐压与低漏电特性,适合作为输入钳位或 transient clamping(小能量瞬态)保护元件。
  • 电源管理与沟通接口:在低至中等电流(≤100mA)的小型电源、驱动与接口电路中作为整流或隔离二极管使用。
  • 信号选通与二极管阵列:共阳结构便于在双路信号选择、混合器和多路保护中实现简单的共用电源节点设计。

四、封装与引脚建议

  • 封装为 SOT-23,适用于标准回流焊装配与自动贴片生产线,节省 PCB 空间。
  • 典型 PCB 实践中,需注意热量集中与焊盘散热设计。Pd 为 350mW,连续工作时应按照电路环境与 PCB 散热条件做电流/功耗降额处理。
  • 引脚标识与排列请参考官方数据手册以确认引脚号与封装方向,避免设计错误。

五、设计与选型注意事项

  • 正向压降 1.2V 在 100mA 时相对偏高,若设计要求更低的正向压降(例如用于提高效率或降低压降损耗),可考虑 Schottky 型二极管替代,但需权衡耐压与反向电流。
  • 对于脉冲高峰电流或大能量浪涌(例如继电器反激、大电容放电),Ifsm = 2A 为非重复峰值,需确保应用场合的浪涌不超过器件限值。
  • 高频开关应用时,还应考虑电路寄生电感、过冲以及 PCB 布线,必要时并联阻尼元件或使用 RC 吸收以抑制过冲导致的器件应力。
  • 在高温或封装密集情况下,注意 Pd 降额与环境温度对漏电流、正向压降的影响。

六、典型电路建议

  • 双路信号整流:利用共阳特性,可将两个信号的负端分别整流到各自的输出,阳极共用电源节点,简化布线。
  • 输入防反接:单只二极管串联在供电输入侧做防反接保护(注意功耗与压降)。
  • 高速开关:与驱动器配合使用于快速切换场合,建议在 PCB 上靠近信号源布置并做好地线回流路径。

七、总结

1SS181 以其 80V 的高耐压、4ns 的快速恢复和 SOT-23 小封装,在小电流、高速开关与保护场合具有良好性价比。选择时需结合正向压降、功耗与工作环境进行热设计和浪涌裕量评估;对更低压降或更高电流需求,应参考其他器件或更大封装的替代品。欲获取精确引脚排列、热阻参数与焊接规范,请参照 ST(先科)提供的完整数据手册。

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