WMSIC Electronic Components

ST CK1V470M-CRE54 aluminum electrolytic capacitor

ModelCK1V470M-CRE54
PackageSMD,D6.3xL5.4mm
BrandST
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ST CK1V470M-CRE54
Type
ST
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ST
Electronic Component
CK1V470M-CRE54
Electronic Component
1
Electronic Component
47uF
Package
SMD,D6.3xL5.4mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
0.498g
Electronic Component
1
Electronic Component
BM0230692709
Electronic Component
2000hrs@105℃
Operating Temperature
40℃~+105℃
Voltage
35V
Capacitor
6.3mm
Capacitor
5.4mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CK1V470M-CRE54 产品概述

一、产品简介

CK1V470M-CRE54 为先科(ST)系列贴片铝电解电容,额定电压 35V,电容量 47µF,允许偏差 ±20%。封装为 SMD,标识尺寸 D6.3×L5.4mm,体积小、容值大,适合对体积和容量有要求的电源滤波与去耦场合。设计适应工业级工作温度范围,可靠性经考量用于中高温环境下的短中期使用。

二、主要参数

  • 电容值:47µF(±20%)
  • 额定电压:35V
  • 封装尺寸:Φ6.3mm × 长度 5.4mm(SMD)
  • 工作温度:-40℃ ~ +105℃
  • 额定寿命:2000 小时 @ 105℃
  • 封装形式:贴片铝电解(极性元件)

三、主要特性

  • 高容值/体积比:在小体积下提供较大电容量,便于在有限空间内实现滤波和储能功能。
  • 宽温适应性:-40℃ 至 +105℃ 的工作温度范围,可满足多数工业与消费电子设备的环境需求。
  • 中高温寿命保证:2000 小时 @105℃ 的寿命指标,适合需承受较高温度运行的设计场景。
  • SMD 封装:适用于自动贴片生产,提高装配效率并节省 PCB 面积。

四、典型应用场景

  • 开关电源输入/输出滤波与储能
  • DC-DC 转换器与稳压模块的去耦与输出电容
  • 工业控制与通讯设备的电源模块
  • 音频放大器电源旁路(需考虑 ESR 与失真要求)
  • 各类中等电压、对寿命有一定要求的电子产品

五、封装与安装建议

  • 该电容为极性器件,装配时必须按极性正确焊接,反接将导致损坏或爆裂。
  • PCB 布局建议预留与实际外形相匹配的焊盘和定位空间,并考虑散热路径以降低结温。
  • 建议参照厂商提供的焊接曲线进行回流焊,避免过高的焊接温度和过长的加热时间导致寿命降低。
  • 安装后若需进行后焊或维修,应遵循分步加热与充分冷却的规范,避免对封装内电解液的不利影响。

六、使用与可靠性建议

  • 为延长使用寿命,建议在保证功能的前提下对工作电压进行适度降额设计,避免长期满额定电压运行,尤其在高温环境中。
  • 注意纹波电流和纹波电压的热应力影响,应在设计时评估实际工作纹波并合理选型,以免局部过热加速老化。
  • 工作环境湿度、振动等也会影响寿命与可靠性,严苛环境下应做额外可靠性验证。

七、注意事项与存储

  • 存放时避免长期在高温、高湿或强光环境中保存,出厂后装配前应按厂家建议进行保管。
  • 运输和装配过程中避免挤压和撞击,以免损伤封装或引起内压变化。
  • 使用前请确认批号与规格,遇特殊需求(如低 ESR、高纹波)可与供应商沟通选配型号。

八、替代与配套说明

在需要更长寿命、低 ESR 或更高频性能时,可考虑规格相同电压与容值但标注低 ESR 或长寿命版本的铝电解或固态铝电解、钽电容或多层陶瓷电容(MLCC)作为并联或替代方案。具体替换需综合体积、成本、ESR、纹波能力及温度特性评估。

总结:CK1V470M-CRE54 是一款尺寸紧凑、容值较大且适应较高温度的贴片铝电解电容,适用于常见的电源滤波与储能场合。设计中关注电压降额、纹波应力与热管理,可获得稳定的使用寿命与性能表现。若需详细电气参数(如 ESR、纹波电流曲线或回流焊曲线),建议向先科获取完整数据表以便设计验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.