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ST M7 diode
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ST M7
- Type
- ST
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ST
- Electronic Component
- M7
- Electronic Component
- 1
- Package
- DO-214AC(SMA)
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.114g
- Electronic Component
- 1
- Electronic Component
- BM0230898844
- Current
- 1A
- Current(Ir)
- 50uA
- (Vf)
- 1.1V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage Rating(Vr)
- 1kV
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
M7 整流二极管（ST / 先科）产品概述
一、产品简介
M7 为一款通用整流二极管，采用 DO-214AC（SMA）表面贴装封装，适用于中低功率整流与保护电路。该器件承受高达1kV的反向电压，连续整流电流为1A，具有良好的耐浪涌能力与宽泛的工作结温范围，便于在多种商业和工业电子设备中使用。
二、主要电气参数
- 正向压降 (Vf)：1.1V @ 1A
- 直流反向耐压 (Vr)：1000V
- 连续整流电流：1A
- 反向电流 (Ir)：50µA（典型测量条件下）
- 非重复峰值浪涌电流 (Ifsm)：30A
- 工作结温范围：-55℃ 至 +150℃
这些参数表明 M7 在高压整流和一般保护应用中具有良好的电气适应性，正向压降在高电流下仍能保持可接受水平。
三、封装与热管理
M7 采用 DO-214AC (SMA) 封装，便于在自动贴装线上组装，具有较好的机械强度和热传导性。尽管器件额定连续电流为1A，但实际电流能力受 PCB 散热条件影响较大。建议在热设计时：
- 在焊盘处增加铜箔面积以降低结-壳温差；
- 通过热过孔或散热铜皮将热量引导至板后层；
- 在高平均功率场合考虑并联或使用更大尺寸封装器件。
四、典型应用场景
- 开关电源与线性电源的整流与续流；
- 充电器、适配器与电源模块的高压整流；
- 极性保护与反向电压保护电路；
- 家电、照明驱动与工业控制器等对高压耐受有要求的应用。
五、设计与使用建议
- 考虑平均功耗：按实际工作电流和导通压降计算器件耗散，确保结温在安全范围内；
- 浪涌管理：Ifsm 为 30A，适合偶发浪涌冲击，但频繁浪涌或更大冲击需选用更高峰值能力器件或增加保护电路；
- 反向漏流：在高温或接近额定 Vr 条件下反向电流可能增大，应在设计中考虑漏电影响；
- 焊接工艺：遵循封装厂家推荐的回流曲线，避免超温或长时间高温暴露，防止封装损伤。
六、可靠性与注意事项
M7 的工作结温范围宽，适用于工业级环境，但长期可靠性取决于热循环、重复浪涌和过压应力。选型时应参考完整数据手册的典型曲线（温度依赖性、瞬态脉冲响应、热阻等）以完成热仿真与寿命评估。对于关键应用或极端工况，建议进行实际样机测试以验证性能。
总结：M7（DO-214AC/SMA）以其高达1kV的反向耐压、1A的连续整流能力和良好的浪涌承受力，适合用于多种高压整流与保护场景。合理的热设计、浪涌管理与焊接工艺是保证其长期可靠工作的关键。
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