WMSIC Electronic Components

SHOU HAN TS3320A 250GF 025 tactile switch TS3320A

ModelTS3320A 250GF 025
PackageSMD
BrandSHOU HAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 163922

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHOU HAN TS3320A 250GF 025
Type
SHOU HAN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHOU HAN
Electronic Component
TS3320A 250GF 025
Electronic Component
1
Package
SMD
Electronic Component
Electronic Component
Electronic Component
Switch
Electronic Component
0.11g
Electronic Component
2.5N
Electronic Component
Electronic Component
Electronic Component
20
Electronic Component
BM0265825534
Electronic Component
Electronic Component
Electronic Component
5
Operating Temperature
20℃~+70℃
Switch
3.35mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TS3320A 250GF 025轻触开关产品概述

一、产品定位与核心价值

TS3320A 250GF 025是首韩(SHOU HAN)品牌推出的小型化立贴式轻触开关,核心定位为高密度紧凑空间下的可靠按键解决方案。产品针对便携电子、小型消费电子等场景的“小尺寸、高可靠性、清晰手感”需求设计,兼顾电气性能与机械耐用性,是低功耗设备按键控制的实用选择。

二、关键参数规格

2.1 电气参数

  • 触点额定电流:50mA(DC)
  • 额定工作电压:12V(DC)
  • 电路结构:单刀单掷(SPST)(按下接通、松开断开的通断型设计)

2.2 机械参数

  • 按钮形状:圆形
  • 操作作用力:250gf±30gf(约2.5N±0.3N)
  • 机械寿命:100000次(10万次)(日常频繁操作下长期稳定)
  • 开关尺寸:长3.3mm × 宽3.3mm × 高2.0mm(超小型化,适配狭小空间)
  • 带支架状态:不带支架
  • 引脚样式:SMD接片(表面贴装设计,适合自动化焊接)

2.3 环境与外观参数

  • 工作温度范围:-30℃ ~ +80℃(宽温适应,满足不同场景环境)
  • 按钮/盖帽颜色:黑色
  • 带灯状态:无灯
  • 安装方式:立贴(SMD)

三、性能与可靠性特点

3.1 紧凑尺寸适配高密度布局

3.3mm×3.3mm的平面尺寸+2.0mm的高度,是同类产品中体积极小的型号之一,可轻松嵌入智能手机、智能手表、蓝牙耳机等便携设备的狭小空间,解决“小设备大功能”的按键布局难题。

3.2 稳定手感与清晰触发反馈

250gf±30gf的作用力设计,既避免了“过轻易误触”,也不会因“过重操作疲劳”,按下时反馈清晰,适合日常频繁使用(如音量调节、电源开关)。

3.3 高寿命与耐用性

10万次机械寿命远超普通轻触开关的标准(通常5万次),可满足3-5年的日常操作需求(按每天100次计算),降低设备后期维护成本。

3.4 宽温环境适应能力

-30℃至+80℃的工作温度范围,可覆盖北方冬季户外(-20℃左右)、南方夏季室内(35℃左右)等场景,不会因温度变化出现“按键卡顿、接触不良”问题。

3.5 可靠电气性能

50mA额定电流与12V DC电压,适配绝大多数低功耗电子设备(如传感器、小型遥控器)的控制需求,触点接触稳定,避免因电流过大导致的触点氧化、粘连。

四、适用应用场景

4.1 便携电子设备

  • 智能手机:音量键、电源键、静音键
  • 智能穿戴:智能手表的功能切换键、蓝牙耳机的配对键
  • 便携音频:MP3、无线耳机的操作按键

4.2 小型消费电子

  • 遥控器:电视、空调、机顶盒遥控器的功能键
  • 计算类设备:计算器、电子词典的数字/功能键
  • 小型家电:加湿器、空气净化器的控制按键

4.3 工业与控制模块

  • 手持检测设备:小型万用表、温湿度检测仪的操作键
  • 智能家居:智能门锁的功能键、小型安防设备的控制键

五、安装与使用注意事项

  1. 焊接要求:SMD立贴安装需控制焊接温度(建议260℃以下),焊接时间不超过3秒,避免过焊导致开关内部结构损坏;
  2. 外力限制:操作时避免施加超过1000gf的外力冲击,防止按钮变形或内部触点损坏;
  3. 环境防护:避免长期暴露在高湿(湿度>85%)、腐蚀性气体环境中,防止触点氧化;
  4. 存储条件:未使用时存储在干燥、常温(15℃-25℃)环境,避免受潮或阳光直射。

这款TS3320A 250GF 025轻触开关凭借“小体积、高可靠、宽温适配”的核心优势,成为便携电子与小型设备按键设计的优选之一,可满足不同场景下的稳定操作需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.