WMSIC Electronic Components

SHOU HAN TF PUSH connector PUSH

ModelTF PUSH
PackageSMD
BrandSHOU HAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
SHOU HAN TF PUSH
Type
SHOU HAN
Minimum package
1000

Technical parameters

Electronic Component
SHOU HAN
Electronic Component
TF PUSH
Electronic Component
1
Package
SMD
Electronic Component
SD / Connector
Electronic Component
1.052g
Type
Micro SD
Electronic Component
1
Electronic Component
BM0227666903
Operating Temperature
25℃~+90℃
Electronic Component
Electronic Component
Connector Type
Card Socket
Electronic Component
1000
Electronic Component
2mm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

首韩SHOU HAN自弹式MicroSD卡(TF卡)连接器产品概述

本概述针对首韩SHOU HAN品牌推出的自弹式MicroSD卡(TF卡)卡座进行详细说明,聚焦产品核心规格、设计特点、应用场景及环境适应性,为电子设备选型提供清晰参考。

一、产品核心定位与基础规格

此款连接器是专为MicroSD卡(TF卡)设计的自弹式存储卡座,采用SMD贴片封装,本体最大高度仅2mm,精准匹配轻薄化设备的集成需求。核心基础规格如下:

  • 卡连接方式:自弹式(按压锁定+再次按压弹出)
  • 兼容卡类型:MicroSD卡(TF卡)
  • 连接器类型:存储卡卡座
  • 检测引脚:无额外插卡状态检测引脚
  • 本体最大高度:2mm(超薄设计)
  • 工作温度范围:-25℃至+90℃
  • 封装形式:SMD(表面贴装)
  • 品牌:首韩(SHOU HAN)

二、核心设计特点解析

2.1 自弹式插拔结构

采用按压式自弹设计,无需借助工具即可完成插卡/取卡:

  • 插入MicroSD卡后按压到底,卡自动锁定;
  • 再次按压则弹出卡体,插拔便捷高效,适合频繁更换存储卡的场景(如运动相机、便携录音笔)。

2.2 超薄SMD封装适配

本体最大高度仅2mm,配合SMD表面贴装封装,具备两大优势:

  • 节省空间:无需PCB插件孔位,可直接集成于板卡表面,适配智能手表、蓝牙耳机等轻薄设备的内部空间限制;
  • 生产高效:兼容自动化贴片生产线,降低人工焊接成本,提升批量生产效率。

2.3 简化设计降本增效

无额外插卡检测引脚,可简化设备电路设计:

  • 减少PCB布线复杂度,缩短研发周期;
  • 降低产品BOM成本,适合仅需基础存储功能(无需实时插卡状态监测)的场景。

三、典型应用场景

基于产品的轻薄设计、宽温适应性及自弹结构,此款卡座广泛适配以下场景:

  1. 便携数码设备:智能手表、运动相机、MP3/MP4、蓝牙耳机等轻薄化产品,2mm高度完美契合内部空间;
  2. 智能家居终端:智能摄像头、环境传感器、智能门锁存储模块等,宽温范围满足室内外不同环境;
  3. 小型工业设备:数据采集终端、便携式测试仪器、小型监控设备等,自弹结构便于现场换卡运维;
  4. 车载辅助设备:行车记录仪(部分车型)、车载MP3等,-25℃~+90℃可应对车内高低温环境。

四、环境适应性与可靠性

4.1 宽温稳定工作

工作温度覆盖-25℃至+90℃,可在以下场景稳定运行:

  • 低温场景:户外冬季、高原低温环境;
  • 高温场景:夏季车内、工业设备运行高温区。

4.2 品牌可靠性保障

首韩SHOU HAN作为专注连接器领域的品牌,产品具备:

  • 符合电子元器件通用标准(兼容RoHS环保要求);
  • SMD封装焊接性能可靠,适配常规回流焊工艺;
  • 自弹结构经过插拔寿命测试(常规场景满足万次以上插拔需求,具体以品牌官方 datasheet 为准)。

五、选型注意事项

选用此款卡座时需注意:

  1. 设备PCB需预留适配SMD封装的焊盘尺寸(参考品牌官方规格);
  2. 若设备需实时监测插卡状态(如插卡触发数据读写),需另行选择带检测引脚的型号;
  3. 插拔寿命需结合设备实际使用频率,常规场景下此款可满足多数需求。

综上,首韩SHOU HAN自弹式MicroSD卡(TF卡)连接器凭借超薄高度、便捷插拔、宽温适应性及简化设计,成为轻薄便携设备、智能家居及小型工业场景中存储卡卡座的优选方案,可有效平衡设计成本与使用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.