WMSIC Electronic Components

SHOU HAN 1.25-3P connector 1.25

Model1.25-3P
PackageSMD,P=1.25MM,HORIZONTAL
BrandSHOU HAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHOU HAN 1.25-3P
Type
SMD, P=1.25MM, HORIZONTAL
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHOU HAN
Electronic Component
1.25-3P
Electronic Component
1
Package
SMD, P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.297g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
3P
Electronic Component
20
Electronic Component
PicoBlade(MX 1.25)
Electronic Component
BM0265736060
Electronic Component
LCP
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1.25mm间距3P卧贴线对板针座产品概述

一、产品核心定位与基本信息

该产品为首韩(SHOU HAN)品牌的线对板连接器件,属于1.25mm小间距系列(参考PicoBlade/MX 1.25系列),采用1排3针(1×3P)卧贴(SMD)封装设计,主要用于小型化电子设备的信号与小功率电源传输,是替代传统大间距连接器、节省PCB空间的优选方案。产品定位偏向中低端消费电子、智能家居及小型工业设备,兼顾可靠性与成本优势。

二、关键参数详解

1. 电气性能参数

  • 额定电流:1A(AC/DC通用),满足常规小功率设备(如传感器、小型模块)的电源与信号传输需求,避免过流风险;
  • 额定电压:125V(AC/DC),符合低压电子设备的安全电压范围;
  • 工作温度范围:-25℃~+85℃,覆盖大部分室内及户外便携设备的环境温度(如车载、手持设备)。

2. 机械与封装参数

  • 针间距:1.25mm,比常见2.0mm间距缩小37.5%,有效节省PCB布局空间;
  • 总PIN数:3P(1排3针),适配3线制信号/电源连接(如三线传感器、串行通信);
  • 安装方式:卧贴(SMD),适合自动化贴装生产线,无需手工焊接,提高生产效率。

3. 材料与阻燃参数

  • 触头材质:磷青铜,具有优异的弹性与导电性,长期使用不易变形;
  • 触头镀层:锡(Sn),抗氧化能力强,降低接触电阻,提升连接可靠性;
  • 塑料主体:LCP(液晶聚合物),耐温性好(可承受回流焊高温),机械强度高;
  • 阻燃等级:UL94V-0,符合安全标准,燃烧时自熄,避免火势蔓延。

三、设计优势与材料特性

1. 小间距高密度布局

1.25mm间距设计大幅减少连接器占用的PCB面积,特别适合智能手环、蓝牙耳机等小型便携设备,或PCB空间紧张的工业控制模块。

2. 可靠连接性能

磷青铜触头的弹性设计确保端子插入后紧密贴合,锡镀层有效防止氧化,减少接触不良问题;长期插拔(按厂商标准可达数千次)后仍能保持稳定连接。

3. 耐环境与安全性能

LCP塑料主体耐回流焊高温(约260℃),可直接参与表面贴装工艺;UL94V-0阻燃等级满足电子设备的安全要求,适用于对防火有要求的场景(如医疗、汽车)。

4. 安装便捷性

卧贴SMD封装适配自动化贴装设备,无需手工焊接,降低人工成本;同时避免了插件式连接器的通孔占用,进一步优化PCB空间。

四、典型应用场景

1. 消费电子领域

  • 便携设备:智能手环、蓝牙耳机、智能手表的内部模块连接(如电池与主板、传感器与主板);
  • 小型家电:智能音箱、无线充电器的内部控制板连接。

2. 智能家居领域

  • 小型传感器:温湿度传感器、人体感应传感器、烟雾报警器的板端连接;
  • 智能控制模块:智能开关、调光器的内部电路连接。

3. 工业控制领域

  • 微型PLC:小型可编程逻辑控制器的输入输出模块连接;
  • 传感器节点:工业现场的微型压力、流量传感器的信号传输。

4. 汽车电子领域

  • 车载小功率设备:胎压监测模块、车内氛围灯控制器的内部连接(需确认具体车载温度范围适配);
  • 车载辅助系统:小型倒车雷达传感器的信号传输。

五、安装与使用注意事项

1. 贴装工艺要求

需遵循厂商推荐的回流焊温度曲线(一般峰值温度≤260℃,回流时间≤60秒),避免LCP塑料变形或触头镀层损坏。

2. 端子连接操作

端子插入时需垂直对准针座,避免倾斜插入导致触头弯曲;插拔时力度适中,不要超过触头的弹性极限。

3. 存储条件

建议存储在温度25℃±5℃、湿度40%~60%的环境中,避免阳光直射或高湿环境,防止触头镀层氧化。

4. 兼容性说明

可兼容PicoBlade系列同类1.25mm间距3P端子,但需确认端子品牌与针座的匹配性,避免接触不良。

该产品通过紧凑设计与可靠材料,满足了小型化设备对连接器件的核心需求,是电子设计中优化空间与成本的实用选择。

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