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SHOU HAN NANO SIM XG6P H1.35 Socket NANO
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SHOU HAN NANO SIM XG6P H1.35
- Type
- SHOU HAN
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SHOU HAN
- Electronic Component
- NANO SIM XG6P H1.35
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- SIM Connector
- Electronic Component
- 0.66g
- Type
- Nano SIM
- Electronic Component
- 5
- Electronic Component
- BM0265736062
- Operating Temperature
- 20℃~+85℃
- Electronic Component
- Electronic Component
- Connector Type
- Card Socket
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
- Electronic Component
- 1.45mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NANO SIM XG6P H1.35 产品概述
一、产品定位与核心价值
NANO SIM XG6P H1.35是一款翻盖式NanoSIM卡座，专为轻薄化电子设备设计，核心价值聚焦于「空间适配、便捷插拔、稳定可靠」三大维度——既解决传统卡座在超轻薄终端中的高度限制问题，又通过翻盖结构提升用户SIM卡插拔体验，同时兼顾自动化生产效率与长期使用稳定性。
二、关键参数与规格
类别 具体参数 卡连接方式 翻盖式（卡扣式闭合） 兼容卡类型 标准NanoSIM卡（12.3×8.8mm） 连接器类型 表面贴装卡座（SMD） 本体最大高度 1.35mm（行业低高度水平） 工作温度范围 -20℃ ~ +85℃ 电气特性 接触电阻≤30mΩ、绝缘电阻≥100MΩ 插拔寿命 ≥5000次（翻盖开合无卡顿）三、结构设计亮点
1. 翻盖式插拔：便捷且防磨损
采用卡扣式翻盖结构，无需工具即可完成SIM卡插入/取出：
- 翻盖开启角度≥120°，便于卡的定位；
- 闭合后卡扣自锁，避免运输/使用中翻盖意外弹开；
- 相比传统直插式卡座，减少SIM卡与接触件的摩擦损耗，延长卡与卡座的使用寿命。
2. 1.35mm低高度：适配超轻薄设备
本体高度仅1.35mm，比常规卡座降低约15%，配合SMD封装的「无引脚贴装」设计，可直接集成于厚度≤5mm的终端内部（如智能手表、超薄手机），满足当前电子设备「轻薄化」趋势。
3. 可靠接触件：抗腐蚀+低阻抗
接触件采用磷青铜基底+镀金表层（金层厚度≥0.3μm）：
- 镀金层抗氧化、耐腐蚀，适应潮湿/高温环境；
- 接触电阻≤30mΩ，保证4G/5G信号传输无衰减；
- 接触点采用「凸点设计」，增加与SIM卡的接触压力，避免虚接。
4. 防呆结构：避免误插
卡座内置SIM卡防呆槽，仅支持正确方向插入，从源头避免卡反向插入导致的接触不良或卡座损坏。
四、主流应用场景
- 移动智能终端：智能手机、平板电脑（如超薄5G手机、平板）；
- 智能穿戴设备：智能手表（如带eSIM/实体SIM的手表）、智能手环；
- 物联网终端：智能POS机、车载导航、工业PDA、智能门锁；
- 便携电子设备：带SIM功能的移动电源、手持对讲机。
五、品质与合规保障
- 品牌背书：由首韩（SHOU HAN）生产，该品牌专注连接器领域10+年，产品通过ISO9001质量体系认证；
- 环保合规：符合RoHS、REACH指令，无铅、无镉等有害物质；
- 全检品控：每批次产品100%检测接触电阻、插拔寿命、焊接可靠性，保证一致性。
六、总结
NANO SIM XG6P H1.35通过「低高度设计+翻盖便捷性+SMD生产适配」，成为轻薄化电子设备SIM卡连接的优选方案——既满足终端的空间压缩需求，又兼顾用户体验与长期可靠性，适用于从消费电子到工业物联网的多场景应用。
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