WMSIC Electronic Components

SHOU HAN MSK13C02-SZ Slide Switch MSK13C02

ModelMSK13C02-SZ
PackageSMD
BrandSHOU HAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHOU HAN MSK13C02-SZ
Type
SHOU HAN
Minimum package
1000 袋装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHOU HAN
Electronic Component
MSK13C02-SZ
Electronic Component
1
Package
SMD
Electronic Component
Switch
Electronic Component
0.114g
Electronic Component
5
Electronic Component
BM0265825518
Electronic Component
Electronic Component
Electronic Component
1
Operating Temperature
25℃~+70℃
Switch
2.8mm
Switch
9.6mm
Switch
Electronic Component
Switch
1.4mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSK13C02-SZ 单刀三掷SMD开关产品概述

MSK13C02-SZ是首韩(SHOU HAN)推出的一款小型化卧贴单刀三掷开关,针对高密度电路设计需求,兼顾紧凑尺寸与实用功能,适用于消费电子、小型家电、工业控制等多领域的多档位切换场景,是微型设备实现模式切换的高性价比选择。

一、产品核心定位

这款开关的核心是**“小体积+多档位”**,解决了传统开关在小型设备中“占空间、档位少”的痛点:

  • 单刀三掷(SP3T)结构支持3个独立档位切换,比单刀双掷多1个功能档位;
  • 9.6mm×2.8mm×1.4mm的超小尺寸,能轻松适配智能手环、蓝牙耳机等微型设备的PCB布局;
  • 低压小电流参数,精准匹配信号控制需求(非大功率负载)。

二、关键参数解析

1. 电路与操作参数

  • 单刀三掷(SP3T):1个公共端+3个切换端,可实现“模式1/模式2/关闭”等3档位功能,覆盖多数小型设备的模式切换需求;
  • 滑钮形状:矩形柱状,操作手感清晰,按压行程适中,不易误触(适合手指或细工具轻按);
  • 引脚样式:SMD接片式,焊接面积比传统引脚大,回流焊兼容性好,抗振动能力更强。

2. 尺寸与安装参数

  • 尺寸:长9.6mm×宽2.8mm×高1.4mm,属于超小型开关范畴(比1206封装元件略大),能塞进0.5cm³以下的设备空间;
  • 安装方式:卧贴(侧面贴装),贴装后垂直高度仅1.4mm,节省PCB垂直空间,适合超薄设备设计;
  • 外观颜色:黑色,耐脏、不易显划痕,与多数电子设备的黑色PCB/外壳视觉协调。

3. 电气与可靠性参数

  • 额定电流/电压:50mA/12V,适合低压小电流信号控制(如传感器模式切换、电路通断),不建议接大功率负载;
  • 工作寿命:1万次(额定参数下),按每天10次计算,可用近3年,满足消费电子的使用周期;
  • 工作温度:-25℃~+70℃,覆盖常见室内外环境(如汽车内部、冬季户外便携设备)。

三、封装与安装优势

MSK13C02-SZ采用SMD封装+卧贴方式,带来3个核心优势:

  1. 空间利用率高:卧贴安装仅占用PCB平面空间,垂直高度低,适合超薄智能穿戴、迷你遥控器等设备;
  2. 自动化生产兼容:SMD接片引脚可通过回流焊直接贴装,无需手工焊接,提高生产效率,降低人工成本;
  3. 焊接可靠性强:接片式引脚与PCB焊接面积大,抗振动、抗冲击能力优于传统引脚,适合便携式设备的日常晃动场景。

四、典型应用场景

1. 便携式消费电子

  • 智能手环/手表:模式切换(普通待机/运动模式/睡眠监测);
  • 蓝牙耳机:配对模式切换(单耳/双耳/充电模式);
  • 迷你遥控器:家电(风扇、加湿器)的档位切换。

2. 小型家电控制

  • 桌面小风扇:风速档位(低/中/高);
  • 迷你加湿器:雾量档位(小/中/大);
  • 智能台灯:亮度模式(暖光/白光/混合光)。

3. 工业与汽车电子配件

  • 小型传感器节点:数据采集模式切换(实时/定时/休眠);
  • 车载小设备:点烟器扩展器的电源模式切换;
  • 微型PLC模块:辅助功能切换(手动/自动/调试)。

五、品质与可靠性保障

首韩(SHOU HAN)作为专注小型开关的品牌,MSK13C02-SZ经过多重可靠性测试:

  • 机械寿命测试:1万次切换无故障,满足日常使用;
  • 高低温循环测试:在-25℃~+70℃范围内循环100次,功能稳定;
  • 环保合规:符合RoHS标准,无铅焊接,适合出口与国内环保要求;
  • 抗振动测试:通过10Hz~2000Hz振动测试,适合便携式设备的晃动场景。

这款开关以“小尺寸、多档位、高可靠性”为核心,精准匹配了当前电子设备小型化、多功能化的趋势,是小型设备档位切换的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.