WMSIC Electronic Components

SXN SMMS0630-680MT Inductor SMMS0630

ModelSMMS0630-680MT
PackageSMD,7.1x6.6x3.0mm
BrandSXN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SXN SMMS0630-680MT
Type
SXN
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SXN
Electronic Component
SMMS0630-680MT
Electronic Component
1
Package
SMD,7.1x6.6x3.0mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.979g
Inductor
68uH
Electronic Component
1
Electronic Component
BM0264968634
Current
1A
Resistor(DCR)
580mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMMS0630-680MT 产品概述

一、产品简介

SMMS0630-680MT 是顺翔诺(SXN)推出的一款一体成型功率电感,标称电感值为 68 μH,公差 ±20%。该器件为表面贴装(SMD)封装,尺寸 7.1 × 6.6 × 3.0 mm,适用于中低功率电源滤波与储能场合。额定电流 1.0 A,饱和电流(Isat)约 1.5 A,直流电阻(DCR)约 580 mΩ,针对空间受限且需一定电流承载能力的移动和嵌入式系统设计。

二、主要电气参数

  • 电感值:68 μH ±20%
  • 额定电流:1.0 A(连续工作参考值)
  • 饱和电流(Isat):1.5 A(磁芯开始明显降感时)
  • 直流电阻(DCR):≈ 580 mΩ(影响发热与损耗)
  • 封装形式:SMD,一体成型功率电感
  • 尺寸:7.1 × 6.6 × 3.0 mm
  • 品牌:SXN(顺翔诺)

三、结构与封装特点

该器件采用一体成型绕制并经模塑封装的结构,具有良好的机械强度和抗振动特性。SMD 贴片封装便于自动化贴装与回流焊工艺,适合批量生产。较宽的封装尺寸提供了较大的铜线截面与磁芯体积,从而在有限空间内平衡电感值与电流承载能力。

四、性能与应用优势

  • 高电感值与中等电流承载,适合需要较大磁量的输入/输出滤波应用。
  • 较低的 DCR 有利于减小 I^2R 损耗,提升转换效率(在额定电流附近仍需关注发热)。
  • 饱和电流 1.5 A 提供一定的抗短时浪涌能力,但在高脉冲或长期偏置情况下需留足裕量。
  • SMD 一体化设计提高可靠性并简化装配过程。

五、典型应用场景

  • DC-DC 降压/升压转换器的输出滤波或储能元件
  • 模拟与数字电源去耦、输入滤波
  • LED 驱动电源与背光驱动器
  • 便携式设备、电池管理系统(BMS)电源模块
  • 消费类、通信、工业控制中的中低功率电源线路

六、选型与设计注意事项

  • 电流裕量:工作电流应低于额定电流并预留足够裕度以避免接近饱和区导致电感骤降。
  • 损耗与散热:根据系统典型电流计算 I^2R 损耗,确认器件发热在可接受范围内;必要时评估周边散热条件。
  • 频率特性:该类功率电感在高频下存在电感下降与寄生电容影响(SRF,自谐频率),高开关频率应用需获取频率阻抗曲线或实际测量。
  • EMC 与布局:贴片安装时应采用短且粗的输入/输出走线,尽量靠近开关器件与电源接口,避免在磁通敏感区域放置差分信号线或敏感元件。
  • 焊接可靠性:遵循厂家回流焊曲线,避免超温或冷却过快导致裂纹或应力。

七、测试与检验建议

  • 电感测量:使用 LCR 表在低频(如 100 kHz 或厂家推荐频点)和加直流偏置条件下测量电感值,以评估直流偏置降感效应。
  • 饱和测试:逐步增加直流偏置电流,记录电感下降点以确认 Isat。
  • 温升测试:在实际电流下进行温升试验,验证长期可靠性。
  • 焊点检查:回流后查看焊接质量及端子润湿性,必要时进行机械震动与温循环试验。

八、包装与资料获取

SMMS0630-680MT 通常以 SMD 贴片卷带(tape & reel)形式供应,便于 SMT 线自动贴装。更多详细的电气曲线、回流焊建议和推荐焊盘尺寸请参阅顺翔诺官方数据手册或向供应商索取样片与规格书以完成最终设计验证。

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