WMSIC Electronic Components

SXN SMCM7060-701T Inductor SMCM7060

ModelSMCM7060-701T
PackageSMD,7x6mm
BrandSXN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SXN SMCM7060-701T
Type
SXN
Minimum package
1500 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SXN
Electronic Component
SMCM7060-701T
Electronic Component
1
Package
SMD,7x6mm
Electronic Component
Common Mode Filter
Electronic Component
0.754g
Electronic Component
1
Channel Count
2
Electronic Component
BM0264968633
Operating Temperature
40℃~+125℃
Resistor
10MΩ
Voltage
125V
Current
4A
@Frequency
500Ω
Resistor(DCR)
15mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMCM7060-701T 共模滤波器产品概述

SMCM7060-701T是顺翔诺(SXN)品牌推出的小体积高性能共模滤波器,专为抑制高频电磁干扰(EMI)设计,兼顾大电流承载与宽温工作特性,适用于消费电子、工业控制、通信设备等多领域的电源线路滤波场景。

一、核心参数总览

该产品的关键参数围绕“高频抑制、大电流、小体积”核心特性设计,具体如下:

参数类别 具体参数 备注 电气基础参数 通道数2、额定电流4A、额定电压125V 双路共模滤波架构 阻抗特性 700Ω@100MHz(典型值) 高频噪声抑制核心指标 直流损耗 单通道DCR≤15mΩ 低损耗减少功率发热 绝缘性能 绝缘电阻≥10MΩ(25℃/DC500V) 电气隔离可靠性保障 机械封装 SMD封装、7×6mm尺寸 小型化PCB布局适配 环境适应性 工作温度-40℃~+125℃ 宽温场景稳定工作

二、关键性能特性

1. 高频EMI抑制能力突出

针对100MHz频段的电磁噪声,产品提供700Ω典型阻抗,可有效衰减该频段的共模干扰(如WiFi、蓝牙、射频信号串扰),解决消费电子、通信设备中常见的电磁兼容问题,满足多数设备的EMC认证需求。

2. 低损耗与大电流平衡

单通道15mΩ的直流电阻(DCR)显著降低功率损耗,配合4A额定电流,可稳定承载电源线路的工作电流,避免因损耗导致的发热问题,适合电源适配器、工业电源等大电流场景。

3. 宽温范围稳定工作

工作温度覆盖-40℃至+125℃,满足工业级(-40+85℃)及部分汽车电子(-40+125℃)的环境要求,可在极端温度下保持电气性能稳定,无需额外散热设计。

4. 小体积适配高密度布局

7×6mm的SMD封装(表面贴装)体积紧凑,可直接集成于小型化PCB板中,节省空间资源,适合笔记本电脑、机顶盒、车载中控等对尺寸敏感的设备。

三、典型应用场景

结合产品参数特性,SMCM7060-701T的核心应用场景包括:

1. 消费电子领域

  • 路由器、机顶盒、智能电视的电源滤波,抑制无线频段共模干扰;
  • 笔记本电脑、平板电脑的电源适配器,降低充电过程中的电磁噪声。

2. 工业控制设备

  • PLC可编程控制器、伺服驱动器的电源线路滤波,满足工业环境EMC标准;
  • 传感器、执行器的信号线路滤波,减少外部干扰对信号传输的影响。

3. 通信与网络设备

  • 基站、交换机、光猫的电源滤波,抑制高频射频干扰;
  • 5G终端设备的电源模块滤波,适配小体积设计需求。

4. 汽车电子(潜在)

  • 车载充电器、中控系统的辅助电源滤波,利用宽温特性适应汽车舱内温度变化(需确认车规认证)。

四、封装与可靠性设计

1. 封装工艺

采用SMD(表面贴装)封装,引脚设计符合IPC标准,支持自动化贴装生产,提高生产效率,降低人工成本。

2. 可靠性保障

  • 绝缘电阻≥10MΩ,避免通道间短路及对外壳放电,保障电气安全;
  • 额定电压125V满足多数低压电源系统需求,配合过压防护设计(需结合应用电路);
  • 温度循环测试符合GB/T 2423.22标准,确保宽温环境下的长期可靠性。

五、选型与使用注意事项

  1. 阻抗匹配:优先用于100MHz频段噪声抑制,若需覆盖其他频段,需结合系统EMI测试结果选择对应阻抗型号;
  2. 电流裕量:建议实际工作电流不超过额定电流的80%(即3.2A以内),避免过载导致性能下降;
  3. PCB布局:滤波器应尽量靠近噪声源(如电源输入端口),输入输出端走线保持隔离,避免二次耦合;
  4. 温度评估:若设备工作环境温度接近+125℃,需确认PCB散热设计是否满足要求,避免局部过热。

总结

SMCM7060-701T共模滤波器凭借高频抑制能力强、小体积、大电流、宽温稳定等核心优势,为多领域设备提供了高效的EMI滤波解决方案。其紧凑的SMD封装与低损耗特性,尤其适合对尺寸和效率要求较高的小型化设备,是替代传统大体积滤波器的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.