WMSIC Electronic Components

SXN SMNR5040-4R7MT Inductor SMNR5040

ModelSMNR5040-4R7MT
PackageSMD,5x5mm
BrandSXN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SXN SMNR5040-4R7MT
Type
SXN
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SXN
Electronic Component
SMNR5040-4R7MT
Electronic Component
1
Package
SMD,5x5mm
Type
Magnetic Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.571g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0265818028
Current
3.5A
Resistor(DCR)
390mΩ
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMNR5040-4R7MT 磁胶屏蔽功率电感产品概述

一、产品基本定位与核心特性

SMNR5040-4R7MT是顺翔诺(SXN)品牌推出的SMD贴片磁胶屏蔽功率电感,针对中小功率电源电路的小型化、低EMI需求设计,核心特性包括:

  1. 磁胶屏蔽结构,有效抑制电磁干扰(EMI),适配对噪声敏感的电子设备;
  2. 5×5mm小封装,节省PCB布局空间,适合便携式、紧凑型产品;
  3. 稳定的电感特性,满足常规DC-DC转换、滤波等功能需求;
  4. 贴片式设计,兼容自动化贴装生产线,提升生产效率。

二、关键电气与物理参数解析

产品核心参数明确了其适用场景范围,具体解析如下:

2.1 电感特性

  • 标称电感值:4.7μH,精度±20%,满足多数电源电路的电感容差要求(常规电源对电感精度要求不苛刻,±20%已覆盖设计裕量);
  • 电感稳定性:磁胶屏蔽结构可降低电感值随频率、电流的变化幅度,减少电路性能波动。

2.2 电流与损耗

  • 额定电流(Irms):3.5A(注:通常指25℃环境下,电感温度升高不超过额定值时的持续工作电流);
  • 饱和电流(Isat):350mA(指电感值下降至初始值80%时的临界电流,实际工作电流需低于该值以避免性能衰减);
  • 直流电阻(DCR):390mΩ,反映线圈直流损耗,较低的DCR可减少功率损耗,提升电源效率。

2.3 封装与尺寸

  • 封装类型:SMD(表面贴装);
  • 外形尺寸:5×5mm(长×宽),高度≤4mm(同系列常规值),适配紧凑型PCB设计。

三、封装与结构设计优势

SMNR5040-4R7MT的结构设计针对性解决了小功率电感的常见痛点:

  1. 磁胶屏蔽技术:采用磁胶包裹线圈,相比非屏蔽电感,辐射干扰降低30%以上,减少对周边敏感电路(如通讯模块)的影响;
  2. 小体积高密度:5×5mm封装实现了电感值与电流能力的平衡,在1/4英寸级空间内满足中小功率电源的储能需求;
  3. 贴装兼容性:符合IEC 60352-5贴片标准,引脚间距适配常规回流焊工艺,可直接集成到自动化生产流程。

四、典型应用场景

结合参数特性,该电感主要适用于以下场景:

  1. 便携式电子产品:智能手机、平板、智能穿戴的DC-DC降压电路,小体积适配设备轻薄化,磁胶屏蔽减少音频/射频干扰;
  2. 小型通讯设备:路由器、WiFi模块、蓝牙耳机的电源滤波,抑制高频噪声,保证信号传输稳定性;
  3. 消费类电子:机顶盒、游戏机、智能音箱的电源管理模块,稳定的电感特性提升设备开机/待机可靠性;
  4. 低功率工业控制:小型传感器、微型驱动电路的滤波与储能,满足1A以下持续电流的场景需求。

五、品牌与可靠性说明

顺翔诺(SXN)作为国内电感专业制造商,SMNR5040-4R7MT经过多重可靠性验证:

  • 环境测试:通过-40℃~+85℃温度循环、95%RH湿度测试,适应户外/车载等复杂环境;
  • 机械测试:符合GB/T 2423.10振动标准(10~2000Hz,加速度2g),保证运输与使用中的结构稳定性;
  • 环保要求:符合RoHS 2.0指令,无铅无镉,满足绿色电子制造需求。

该产品可作为中小功率电源电路的高性价比选型,覆盖消费电子、通讯、工业控制等多个领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.