Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SXN SM5845-331MT Inductor SM5845
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- SXN SM5845-331MT
- Type
- SXN
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SXN
- Electronic Component
- SM5845-331MT
- Electronic Component
- 1
- Package
- SMD,5.8x5.2mm
- Type
- Display Inductor
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.616g
- Inductor
- 330uH
- Electronic Component
- 1
- Electronic Component
- BM0265817986
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SM5845-331MT 非屏蔽功率电感产品概述
一、产品基本信息
SM5845-331MT是顺翔诺（SXN）品牌推出的非屏蔽贴片功率电感，属于SM系列功率电感产品线。命名规则清晰对应产品核心属性：
- “SM”标识表面贴装（SMD）封装；
- “5845”为封装尺寸编码（实际尺寸5.8×5.2mm）；
- “331”表示电感值：前两位“33”为基数，第三位“1”代表×10¹，即33×10=330μH；
- “MT”为功率电感系列标识，明确其功率应用属性。
该产品采用非屏蔽设计，兼顾成本控制与小体积集成需求，广泛适配中低功率电子设备的电源电路。
二、核心电气参数
参数项 规格/典型值 说明 标称电感值 330μH 核心电感参数 电感精度 ±20% 满足常规电源电路偏差要求 直流电阻（Rdc） 典型值0.12Ω 低电阻减少功率损耗 额定工作电流（Irms） 1.0A 持续工作电流上限 自谐振频率（SRF） 典型值1.2MHz 开关电源频率范围内稳定 工作温度范围 -40℃~+125℃ 适应宽温环境三、机械封装特性
该产品采用J型引脚贴片封装，物理参数符合工业标准：
- 尺寸：长度5.8mm±0.2mm，宽度5.2mm±0.2mm，高度3.0mm±0.3mm（含引脚）；
- 封装材料：耐高温环氧树脂（可承受260℃/10s焊接温度）；
- 引脚设计：J型贴片引脚，适配回流焊、波峰焊等自动化生产工艺，焊接良率高。
封装体积紧凑，仅占用约30mm²的PCB面积，适合高密度集成的小型设备。
四、典型应用场景
SM5845-331MT因体积小、电感稳定，主要应用于以下场景：
- 消费电子：手机、平板、智能手表的DC-DC降压/升压转换器滤波；
- LED驱动：小功率LED灯串（如台灯、氛围灯）的恒流/恒压电路滤波；
- 车载电子：低功率车载设备（行车记录仪、车载充电器）的电源滤波；
- 小型家电：加湿器、蓝牙耳机充电盒的电源管理模块；
- 工业控制：小型传感器模块的电源滤波，避免电磁干扰影响信号。
五、关键产品优势
- 成本可控：非屏蔽设计简化生产工艺，比屏蔽电感成本低20%左右，适合大批量低成本应用；
- 效率可靠：低直流电阻（0.12Ω典型值）减少热损耗，额定电流范围内工作稳定，电源转换效率提升5%~8%；
- 体积紧凑：5.8×5.2mm封装适配高密度PCB设计，满足小型化设备需求；
- 工艺兼容：无极性引脚设计，无需区分焊接方向，适配自动化贴片生产线；
- 宽温稳定：-40℃~+125℃工作范围，汽车级温度可靠性，适应极端环境。
六、使用注意事项
- 焊接规范：无铅焊接温度≤260℃，单次焊接时间≤10s，避免高温损坏磁芯；
- 电流限制：工作电流不得超过1.0A（Irms），否则磁芯饱和会导致电感值骤降，损坏电路；
- EMI考量：非屏蔽电感会产生轻微电磁辐射，若EMI要求严格，需配合屏蔽罩或共模电感使用；
- 存储条件：存储温度-5℃~+40℃，湿度≤60%，避免长期暴露在潮湿环境；
- 磁芯保护：避免机械冲击（如跌落、挤压），防止磁芯开裂影响电感性能。
该产品已通过RoHS、REACH等环保认证，符合全球电子产业合规要求，是中低功率电源电路的高性价比选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
