WMSIC Electronic Components

SXN PK0608-221MB Inductor PK0608

ModelPK0608-221MB
PackageRADIAL
BrandSXN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SXN PK0608-221MB
Type
RADIAL
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SXN
Electronic Component
PK0608-221MB
Electronic Component
1
Package
Electronic Component
Type
Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.095g
Inductor
220uH
Electronic Component
1
Electronic Component
BM0265793600
Current
440mA
Resistor(DCR)
900mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PK0608-221MB 功率电感产品概述

一、产品基本信息

PK0608-221MB是顺翔诺(SXN)品牌推出的插件式非屏蔽功率电感,型号命名对应明确:

  • “PK”标识功率电感属性;
  • “0608”为封装规格(典型径向引线插件尺寸:6mm×8mm);
  • “221”表示标称电感值220μH(22×10¹);
  • “MB”为产品系列代码。

该电感采用径向引线封装,无需贴片机即可完成安装,适配手工焊接或波峰焊工艺,是小型电子设备供电电路的高性价比组件。

二、核心电气性能参数

产品参数围绕储能能力、损耗控制、工作稳定性三个维度设计,关键指标如下:

  1. 电感值与精度:标称220μH,精度±20%,满足大多数电源滤波、DC-DC储能的工程需求(无需超精密场景的高精度要求);
  2. 额定电流:440mA(指电感持续工作时,磁芯温升不超过允许范围的最大电流),支撑小型低功耗设备的供电;
  3. 直流电阻(DCR):900mΩ,直接影响功率损耗(公式:(P=I^2×R)),在440mA额定电流下,损耗约0.174mW,效率较高;
  4. 非屏蔽特性:无磁屏蔽罩,漏磁相对屏蔽电感略大,但结构简单、成本更低。

三、物理封装与工艺特性

  1. 径向引线插件封装:引线垂直于电感本体,安装时可直接插入PCB焊盘,手工焊接或波峰焊均易操作,适合批量生产或小批量试制;
  2. 紧凑尺寸:6mm×8mm封装,占用PCB面积小,适配智能穿戴、小型传感器等微型设备的空间限制;
  3. 绕线工艺:采用漆包铜线绕制,磁芯为铁氧体材料(保证电感值稳定性与储能效率),DCR控制在900mΩ以内,平衡成本与损耗;
  4. 非屏蔽结构:无金属屏蔽罩,避免额外成本与体积,适合对电磁干扰(EMI)要求不高的场景。

四、典型应用场景

PK0608-221MB的参数特性适配小型低功耗电子设备的供电与滤波:

  1. DC-DC转换电路:如5V转3.3V、3.3V转1.8V等小电流降压/升压模块的储能电感;
  2. 电源滤波电路:线性电源输出端纹波滤波、开关电源辅助滤波,滤除高频噪声与电压波动;
  3. 智能穿戴设备:智能手环、蓝牙耳机等设备的电池供电电路,满足低电流、小体积需求;
  4. 小型传感器节点:温湿度传感器、运动传感器等低功耗节点的电源稳压滤波,提升信号稳定性;
  5. 小功率LED驱动:LED灯串恒流驱动电路中的储能组件,适配低电流输出需求。

五、产品优势与场景匹配

  1. 成本可控:非屏蔽结构+插件封装,无贴装成本,适合中小批量生产或成本敏感项目;
  2. 安装便捷:径向引线无需特殊设备,手工焊接即可完成,降低生产门槛;
  3. 损耗低效率高:900mΩ的DCR在同规格中处于中等偏下,小电流下损耗可忽略,提升电源转换效率;
  4. 尺寸紧凑:6mm×8mm封装适配微型设备,不占用额外空间;
  5. 电流能力匹配:440mA额定电流覆盖大部分小型低功耗设备的工作电流范围,无需过度选型。

六、选型与使用注意事项

  1. 电流降额:实际工作电流建议不超过额定电流的80%(≤352mA),避免磁芯过热导致电感值漂移;
  2. 温度适应性:铁氧体磁芯稳定工作范围为-40℃~85℃,若环境温度超85℃,需评估性能衰减;
  3. EMI场景考量:非屏蔽电感漏磁大,若系统对EMI要求高(如医疗设备、射频通信),需配合屏蔽盒或换屏蔽电感;
  4. 焊接规范:手工焊温度≤350℃、时间≤3秒,波峰焊温度≤260℃,避免损坏磁芯;
  5. 精度匹配:±20%精度适合常规电源场景,精密仪器需选±10%及以上精度型号。

该产品凭借平衡的性能与成本优势,成为小型电子设备电源电路的常用选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.