WMSIC Electronic Components

SXN SMMS0630-1R0M Inductor SMMS0630

ModelSMMS0630-1R0M
PackageSMD,7.3x6.6x3mm
BrandSXN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SXN SMMS0630-1R0M
Type
SMD, 7.3X6.6X3MM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SXN
Electronic Component
SMMS0630-1R0M
Electronic Component
1
Package
SMD,7.3x6.6x3mm
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.049g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0265793562
Current
13A
Resistor(DCR)
7.25mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMMS0630-1R0M 功率电感产品概述

一、产品基本属性

SMMS0630-1R0M是顺翔诺(SXN)品牌推出的一体成型功率电感,采用表面贴装(SMD)封装,型号命名直接对应核心参数:

  • “0630”为封装尺寸编码,实际尺寸为7.3×6.6×3mm(长×宽×高);
  • “1R0”代表标称电感值1μH;
  • “M”标识精度为±20%。

该产品针对高功率、小体积场景设计,兼顾大电流承载能力与低损耗特性,是电源电路的核心储能元件。

二、关键性能参数解析

1. 电感值与精度

标称电感值1μH,精度±20%,满足大多数功率电路对电感量的实用需求——无需额外高精度匹配,可降低电路设计成本,同时适配宽范围负载波动。

2. 饱和电流(Isat)

**16A(直流)**是核心关键参数:指电感磁场饱和前可承载的最大直流电流。当电流超过此值,电感量会急剧下降(甚至失效)。16A的高饱和电流,确保产品在大负载(如10A以上)下仍能稳定保持电感特性,避免电路因电感饱和导致输出异常。

3. 直流电阻(DCR)

7.25mΩ(典型值):极低的直流电阻意味着电流通过时的功率损耗小(损耗公式:(P=I^2R))。以10A工作电流为例,损耗仅约0.725W,大幅降低电源模块的热损耗,提升整体转换效率。

三、设计特点与核心优势

1. 一体成型结构

采用磁芯与线圈一体压制工艺,相比传统绕线电感:

  • 漏磁更小,电磁干扰(EMI)抑制能力提升30%以上,可简化电路EMI滤波设计;
  • 结构紧凑坚固,抗振动、抗冲击性能优异,适合车载、工业等严苛环境(振动测试可达10G以上)。

2. 小体积高密度

封装尺寸仅7.3×6.6×3mm,在同等电流承载能力下,体积比常规功率电感缩小约30%,为设备小型化、轻薄化提供直接支持(如笔记本电脑、快充充电器的紧凑设计)。

3. 低损耗高效率

7.25mΩ的DCR使电感在高电流场景下发热极少,配合16A饱和电流,可将DC-DC转换器的整体效率提升2%-3%,尤其适合对效率敏感的电源模块(如服务器电源、车载快充)。

4. 自动化贴装适配

SMD封装兼容主流回流焊工艺(峰值温度230-245℃,焊接时间≤30s),贴装精度高,适合大规模自动化生产,降低人工成本与装配误差。

四、典型应用场景

SMMS0630-1R0M的性能匹配多类高功率场景:

  1. 开关电源(DC-DC转换器):笔记本电脑、服务器、通信基站的降压/升压模块;
  2. 车载电子:车载充电器(65W/100W)、中控系统、ADAS电源;
  3. 工业控制:PLC、伺服驱动器、机器人电源模块;
  4. LED驱动:大功率LED照明(如路灯、面板灯)的恒流/恒压驱动;
  5. 消费电子:手机快充充电器、移动电源的功率电感。

五、封装与安装注意事项

  1. 焊盘匹配:PCB焊盘宽度建议≥1.2mm,间距需符合SMD封装标准(参考顺翔诺官方 datasheet);
  2. 焊接工艺:禁止波峰焊(可能导致磁芯受热开裂),优先回流焊;
  3. 环境要求:工作温度范围-40℃至+125℃,存储温度-55℃至+150℃,避免长期暴露于潮湿环境;
  4. 机械防护:安装时避免过度弯折引脚,防止磁芯或线圈损坏。

六、品牌与品质保障

顺翔诺(SXN)是专注于电感研发生产的品牌,SMMS0630-1R0M采用成熟的一体成型工艺,参数一致性控制在±10%以内(超过标称精度),所有产品均通过RoHS环保认证,批量供货稳定性高,适合OEM/ODM客户的标准化生产需求。

该产品以“小体积、大电流、低损耗”为核心竞争力,可有效解决高功率电路的小型化与效率问题,是电源设计的优选元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.