WMSIC Electronic Components

SHIKUES SS54G Schottky Diode SS54G

ModelSS54G
PackageSMA
BrandSHIKUES
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHIKUES SS54G
Type
SHIKUES
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHIKUES
Electronic Component
SS54G
Electronic Component
1
Package
SMA
Electronic Component
Schottky Diode
Electronic Component
0.118g
Electronic Component
1
Electronic Component
BM0228037959
Current
5A
Diode
Electronic Component
Current(Ir)
1mA@40V
(Vf)
550mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS54G 肖特基二极管(SHIKUES 时科)产品概述

一、产品概述

SS54G 为 SHIKUES(时科)品牌的独立式肖特基整流二极管,采用 SMA 封装,面向中大电流低压降整流和保护场景。器件在 5A 直流载流下正向压降仅为 0.55V,具备较低的功率损耗与快速响应特性,适用于开关电源、整流桥、反并联保护与电源防反接等应用。

二、主要技术参数

  • 二极管配置:独立式(单个芯片)
  • 正向压降:Vf = 0.55V @ If = 5A
  • 直流反向耐压:Vr = 40V(最大反向电压)
  • 连续整流电流:If(AV) = 5A
  • 反向漏电流:Ir = 1mA @ Vr = 40V(注意温度相关升高)
  • 非重复峰值浪涌电流:Ifsm = 120A(冲击浪涌能力)
  • 工作结温:-55℃ ~ +150℃
  • 封装:SMA(适合自动贴装与手工焊接)

三、性能特点

  • 低正向压降:在大电流工况下降低导通损耗,提高效率与散热裕量。
  • 快速恢复/肖特基特性:无明显正向恢复峰值,适合高频整流。
  • 良好的浪涌承受能力:120A 非重复峰值浪涌适用于启动冲击及短时过载情况。
  • 宽温度范围:适应工业级温度变化,适合恶劣环境使用。

四、封装与热管理

SMA 封装体积小、热阻适中,便于 PCB 布局与散热设计。实际使用时需注意:

  • 在持续 5A 电流下,正向功耗为 P≈Vf×If(约 2.75W),需通过加大铜箔面积或散热片降低结温。
  • 采用足够的 PCB 铜箔(+/- 侧的散热铺铜)并考虑通孔与散热层,可显著改善热性能。
  • 焊接温度按照封装推荐值执行,避免过热影响可靠性。

五、典型应用场景

  • 开关电源整流与续流二极管(低压输出端);
  • 电源反向保护与负载隔离(OR-ing);
  • 汽车电子 12V/24V 系统(需评估瞬态);
  • 电池充放电路径、适配器、LED 驱动等需低压损线路。

六、选型与使用建议

  • 若系统工作电压接近或可能超过 40V,应改选更高 Vr 的型号或增加瞬态抑制元件。
  • 注意反向漏电流随温度急剧上升,设计中需考虑高温下的漏电容许范围。
  • 长时间连续大电流工作建议留足安全裕度并做好热仿真,必要时选择更大封装或并联使用(注意分流均衡)。

七、可靠性与注意事项

  • 典型肖特基在高温下漏电流和热失控风险需严加评估;在高温环境应适当降额使用。
  • PCB 布局应避免热集中和高温工作点,保持良好散热路径与可靠焊接。
  • 出于电气保护考虑,可在高速开关应用中配合 RC 抑制或 TVS 以防瞬态超压。

总结:SS54G(SHIKUES 时科)在 40V/5A 等级下以低正向压降与良好浪涌能力,为中低压、高效率整流与保护方案提供了经济且可靠的选择。选择与应用时重点关注热管理与高温漏电特性,以确保长期稳定运行。

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