WMSIC Electronic Components

Sunway SC0402J2702F2ANRH

ModelSC0402J2702F2ANRH
Package0402
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0402J2702F2ANRH
Type
SUNWAY
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0402J2702F2ANRH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
27kΩ
Electronic Component
10
Electronic Component
BM0266060219
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0402J2702F2ANRH 贴片电阻产品概述

一、产品基本信息

SC0402J2702F2ANRH是信维通信(Sunway) 推出的通用型贴片电阻,型号中各字符对应核心属性:

  • 0402:英制封装尺寸(对应公制1005,长1.0mm×宽0.5mm),属于小型化贴片封装;
  • J:阻值精度等级(±5%);
  • 2702:阻值编码(27×10²=27kΩ);
  • 后缀“F2ANRH”为信维内部封装/包装标识,适配标准编带包装(便于自动化贴装)。

该产品定位于低功耗通用电路,覆盖消费电子、工业控制等多领域应用,是高密度PCB设计的常规选型元件。

二、关键性能参数详解

参数类型 具体指标 说明 标称阻值 27kΩ(27000Ω) 符合E24系列电阻阻值标准 阻值精度 ±5% 通用精度等级,满足多数非精密电路需求 额定功率 62.5mW(0.0625W) 0402封装典型功率,适配低功耗场景 温度系数(TCR) ±100ppm/℃ 温度每变化1℃,阻值变化±0.01%(标称值) 工作温度范围 -55℃ ~ +155℃ 覆盖工业级与部分车载环境温度波动 封装形式 0402(1005公制) 小型化封装,适配高密度PCB布局

三、封装与工艺特点

1. 小型化封装优势

0402封装体积仅为1.0mm×0.5mm×0.4mm(典型厚度),相比0603封装体积缩小约60%,可有效降低PCB面积,适配便携设备(手机、智能穿戴) 、小型模块(传感器、射频前端) 等高密度设计需求。

2. 厚膜电阻工艺

采用厚膜印刷工艺 制备电阻膜层,具有以下特点:

  • 成本可控,适合批量生产;
  • 电阻膜层均匀性好,阻值一致性达标(批量离散度控制在±5%内);
  • 端电极采用镍/锡镀层,兼容回流焊、波峰焊,焊接可靠性高(虚焊率≤0.1%)。

3. 环保合规

产品符合RoHS 2.0(无铅、无镉、无汞)及REACH法规要求,适配全球市场环保准入标准。

四、典型应用场景

结合参数特性,该电阻主要应用于以下场景:

1. 消费电子

  • 智能手机/平板:信号调理电路(滤波、分压)、电源管理模块(辅助限流);
  • 智能穿戴:手环/手表的传感器接口(压力、心率传感器信号处理);
  • 智能家居:小型控制器(如智能插座、温湿度传感器)的辅助电阻。

2. 工业控制

  • 小型工业传感器模块:温度、流量传感器的信号放大/滤波电路;
  • PLC(可编程逻辑控制器):I/O接口的上拉/下拉电阻,适应-55℃~+155℃的工业环境波动。

3. 汽车电子(部分场景)

  • 车载小型附件:车载充电器、氛围灯控制模块的电阻元件(需确认具体车型认证要求);
  • 车载传感器:胎压监测系统(TPMS)的辅助电阻(适配-40℃~+125℃的常规车载温区)。

4. 通信设备

  • 小型基站/路由器:射频前端的匹配网络、电源滤波电路,适配高密度PCB布局。

五、品牌与可靠性优势

信维通信作为国内被动元件领域的头部厂商,SC0402系列电阻具备以下可靠性优势:

  1. 认证保障:通过ISO9001质量管理体系、ISO14001环境管理体系认证,部分产品通过AEC-Q200(汽车级)认证(需确认具体型号);
  2. 可靠性测试:经过高温存储(155℃×1000h)、温度循环(-55℃~+155℃×1000次)、湿度试验(85℃/85%RH×1000h),阻值漂移≤±0.5%,符合工业级可靠性要求;
  3. 批量一致性:采用自动化生产与在线检测,批量产品阻值离散度控制在±3%内(远优于标称±5%精度),减少电路调试难度。

六、选型与使用注意事项

  1. 功率降额:0402封装额定功率62.5mW,实际使用建议降额50%以上(实际功耗≤31.25mW),避免过热导致阻值漂移或损坏;
  2. 焊接工艺:
    • 回流焊:峰值温度控制在240℃~260℃,时间≤10秒;
    • 波峰焊:需使用无铅焊料,焊接温度≤250℃,避免虚焊;
  3. 精度适配:若电路需更高精度(如±1%),需更换为F级(±1%)或更高级别电阻,此型号仅适用于通用精度需求;
  4. 温区适配:极端高温(155℃长时间工作)时,需进一步加大功率降额(如降额70%),避免性能衰减。

总结

SC0402J2702F2ANRH作为信维通信的通用型0402贴片电阻,凭借小型化封装、宽温范围、稳定性能 ,广泛适配消费电子、工业控制等领域的低功耗电路设计,是高密度PCB布局的理想选型元件,可满足多数通用电路的阻值控制与可靠性需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.