Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SC0201F2000G1BNRH是信维通信(Sunway) 推出的一款0201封装贴片厚膜电阻,属于该品牌标准电阻系列,针对高密度、低功耗电子设备的电路设计需求优化,兼顾精度、稳定性与成本优势。信维通信作为国内射频与元器件领域的头部企业,其电阻产品经严格工艺管控,符合RoHS等环保标准,广泛应用于消费电子、IoT、工业控制等领域。
额定阻值200Ω,精度±1%,满足大多数中高端电子设备的信号采样、分压、阻抗匹配等精准度需求,无需额外校准即可适配常规电路,避免因阻值偏差导致的信号失真或功率损耗。
温度系数(TCR)±200ppm/℃,表示温度每变化1℃,阻值变化±0.02%;结合**-55℃~+125℃宽温范围**,在户外、工业等高低温环境下仍能保持稳定性能,适配多场景需求。
采用厚膜印刷+高温烧结工艺,电阻膜层均匀致密,抗脉冲能力优于薄膜电阻,适合瞬态信号场景(如射频匹配电路)。
产品采用0201英制贴片封装,公制尺寸约为0.508mm(长)×0.254mm(宽),体积仅为常规0402封装的1/4左右,显著降低PCB占用面积,适配智能手机、智能穿戴、小型IoT模块等对空间要求严苛的设备设计,助力产品小型化、轻量化。
产品符合IEC 61000-4系列电磁兼容标准,抗振动(102000Hz,1g加速度)、抗湿度(85℃/85%RH环境下1000小时阻值变化≤0.5%)性能达标,额定条件下寿命≥10000小时。存储建议常温干燥(温度-4060℃,湿度≤70%),避免受潮影响焊接与性能。
SC0201F2000G1BNRH凭借小封装、宽温稳定、成本可控等特点,成为高密度低功耗电路的优选电阻之一,适配多领域电子设备的设计需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products