WMSIC Electronic Components

Sunway SC0201F1002G1BNRH

ModelSC0201F1002G1BNRH
Package0201
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0201F1002G1BNRH
Type
SUNWAY
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0201F1002G1BNRH
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
10kΩ
Electronic Component
10
Electronic Component
BM0266080453
Operating Temperature
55℃~+125℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0201F1002G1BNRH厚膜贴片电阻产品概述

SC0201F1002G1BNRH是信维通信(Sunway)推出的一款小型化厚膜贴片电阻,针对高密度PCB布局设计,兼顾精度与可靠性,适用于消费电子、工业控制等多领域的电路设计需求。

一、产品基本定位

该电阻属于0201封装通用型厚膜贴片电阻,核心特点为小型化、低功率、中等精度,可满足大多数常规电路的电阻分压、信号滤波、电流限制等功能需求,同时适配RoHS环保标准,符合现代电子设备的小型化、轻量化设计趋势。

二、核心电气性能参数

SC0201F1002G1BNRH的关键电气参数均经过信维通信的标准化测试,具体如下:

  • 阻值与精度:标称阻值10kΩ(代码标识为“1002”,对应“100×10²Ω”),精度等级±1%,可满足多数工业级、消费级电路对阻值偏差的要求;
  • 功率与电压:额定功率50mW,最大工作电压25V(由功率与阻值的安全关系推导:( V=\sqrt{P×R}=\sqrt{0.05W×10000Ω}≈22.4V ),25V为额定安全电压上限);
  • 温度系数(TCR):±200ppm/℃,表示温度每变化1℃,阻值变化范围为±0.02%,适用于温度波动较小的常规工作环境;
  • 其他电气特性:绝缘电阻≥1GΩ(DC500V,常温),寄生电感与电容均处于微纳级(适配高频电路的基础需求)。

三、封装规格与尺寸

采用0201英制封装,具体尺寸参数符合IPC/JEDEC标准:

  • 英制尺寸:0.020英寸(长度)×0.010英寸(宽度);
  • 公制尺寸:0.60mm(长度)×0.30mm(宽度)×0.23mm(厚度);
  • 焊盘设计:适配常规0201封装焊盘,可兼容多数PCB板的高密度布局(最小焊盘间距≥0.15mm);
  • 环保认证:符合RoHS 2.0(无铅、无镉、无汞等有害物质)及REACH法规要求。

四、工作环境适应性

该电阻的环境适应性覆盖工业级与部分汽车级场景:

  • 工作温度范围:-55℃~+125℃,宽温范围可满足极端环境下的稳定工作(如户外物联网终端、工业控制模块);
  • 湿度与耐候性:工作湿度0~95%RH(非凝结),存储湿度≤98%RH(非凝结),具备良好的抗潮湿能力;
  • 可靠性测试:通过-55℃~+125℃温度循环测试(1000次循环后阻值变化≤0.3%)、回流焊耐热测试(峰值温度260℃,持续时间≤10s)、负载寿命测试(1000小时额定功率下,阻值变化≤0.5%)。

五、典型应用场景

基于小型化、低功率与中等精度的特点,SC0201F1002G1BNRH适用于以下场景:

  1. 消费电子领域:智能手机、智能手表、蓝牙耳机等设备的传感器信号调理电路、电源管理模块的分压电阻;
  2. 工业控制领域:小型PLC、传感器节点的滤波电路、电流检测电路;
  3. 物联网终端:低功耗无线模块(如LoRa、NB-IoT)的信号分压、偏置电路;
  4. 汽车电子辅助电路:车载中控屏的背光控制电路、传感器辅助电路(非安全关键部位)。

六、品质与品牌保障

信维通信作为国内电子元器件领域的知名企业,对该电阻的生产工艺与品质管控严格:

  • 工艺优势:采用厚膜印刷烧结工艺,电阻膜层均匀性好,阻值稳定性优于常规薄膜电阻的成本敏感型产品;
  • 测试标准:符合IEC 61041《电子设备用固定电阻器 第1部分:总规范》及GB/T 5729《电子设备用固定电阻器 第一部分:总规范》;
  • 品质保障:提供批量一致性保障,单批次阻值偏差符合±1%精度要求,长期可靠性符合行业主流标准。

该电阻凭借小型化设计、稳定的电气性能与可靠的环境适应性,成为电子设备小型化升级中的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.