WMSIC Electronic Components

Sunway SC0805F2202F4ANRH

ModelSC0805F2202F4ANRH
Package0805
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0805F2202F4ANRH
Type
SUNWAY
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0805F2202F4ANRH
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.028g
Electronic Component
22kΩ
Electronic Component
1
Electronic Component
BM0266060215
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0805F2202F4ANRH 贴片厚膜电阻产品概述

一、产品基本属性

SC0805F2202F4ANRH是信维通信(Sunway)推出的0805封装厚膜贴片电阻,属于通用型电子元器件。产品采用厚膜丝网印刷工艺制造,兼顾稳定性、经济性与小体积优势,适配各类中精度电路设计需求,是消费电子、工业控制等领域的常规选型器件。

二、核心电气参数解析

该电阻的关键指标明确,可支撑稳定的电路功能实现:

  • 阻值与精度:标称阻值22kΩ(编码“2202”对应22×10²Ω),精度±1%,即实际阻值偏差不超过标称值的1%,能精准满足信号分压、限流等中精度要求;
  • 功率与电压:额定功率125mW(25℃环境下),额定工作电压150V,可稳定承载中低功率负载,避免过载损坏;
  • 温度特性:温度系数(TCR)±100ppm/℃,表示每变化1℃,阻值变化不超过标称值的百万分之一百,适应一定温度波动场景;
  • 工作温度范围:-55℃至+155℃,覆盖工业级环境的高低温区间,可在极端环境下长期稳定工作。

三、封装与工艺特点

采用行业通用的0805贴片封装,物理尺寸符合国际标准(长2.0mm±0.2mm,宽1.2mm±0.2mm,厚度约0.5mm),适配自动化SMT贴装工艺,适合高密度PCB布局;
厚膜工艺通过“丝网印刷电阻浆料→高温烧结→电极制备”流程实现,相比薄膜电阻成本更低,相比线绕电阻体积更小,兼具可靠性与经济性,抗冲击、抗磨损性能优于薄膜电阻。

四、典型应用场景

基于参数与封装特性,该电阻适用于以下场景:

  1. 消费电子:手机、平板、智能穿戴的电源滤波、信号分压电路,满足便携设备小体积与稳定需求;
  2. 工业控制:PLC、传感器信号调理电路,适应-55℃至155℃的工业环境温度波动;
  3. 通信设备:路由器、交换机的电源模块限流、信号衰减电路,保障通信信号稳定;
  4. 汽车辅助电路:车载音响、中控面板的信号处理电路(参数支持中温环境,需结合具体汽车级认证场景)。

五、可靠性与环保要求

产品符合RoHS指令,无铅无镉,满足环保法规要求;厚膜工艺赋予其良好的抗过载与抗浪涌能力,通过温度循环(-55℃~155℃,循环1000次)、湿度老化(85℃/85%RH,1000h)等可靠性测试,可长期稳定工作;同时支持无铅回流焊工艺(峰值温度230-250℃,时间≤10s),适配现代电子制造流程。

六、使用注意事项

  1. 功率降额:环境温度升高时需降额使用(如125℃时功率需降至约62.5mW),避免热失效;
  2. 电压限制:实际工作电压不超过150V,防止绝缘击穿;
  3. 贴装规范:遵循0805封装的常规SMT参数,避免贴装偏移或焊接不良;
  4. 存储条件:未开封产品存储于温度-40℃~+60℃、湿度≤60%RH环境,开封后12个月内使用完毕。

该产品凭借稳定的电气性能、通用封装与成本优势,成为电子设计中中精度电阻的常规选型,可覆盖多领域的电路需求。

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