WMSIC Electronic Components

Sunway SC0402J3301F2ANRH

ModelSC0402J3301F2ANRH
Package0402
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0402J3301F2ANRH
Type
SUNWAY
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0402J3301F2ANRH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
3.3kΩ
Electronic Component
10
Electronic Component
BM0266065791
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0402J3301F2ANRH 厚膜贴片电阻产品概述

一、产品定位与核心参数

SC0402J3301F2ANRH是信维通信(Sunway)针对高密度小型化电子电路推出的0402封装厚膜贴片电阻,核心参数精准匹配常规电路需求:标称阻值3.3kΩ、精度±5%、额定功率62.5mW、最大工作电压50V、温度系数±100ppm/℃,工作温度范围覆盖-55℃~+155℃,封装尺寸为0402(公制1.0mm×0.5mm)。该产品兼顾小型化、可靠性与成本优势,适合批量应用于消费电子、工业控制等领域。

二、电气性能规格

2.1 阻值与精度

标称阻值3.3kΩ,精度等级±5%(型号中“J”对应工业级±5%精度),无需额外校准即可满足常规电路的阻抗匹配、分压、限流需求。例如在电源滤波电路中,可稳定实现信号衰减,避免电压波动对后级电路的干扰。

2.2 功率与电压

额定功率62.5mW,最大工作电压50V。实际应用中需遵循功率-电压匹配原则((P=U^2/R)),确保工作电压不超过50V且功耗不超过额定值,避免电阻过热导致阻值漂移或损坏。

2.3 温度系数

±100ppm/℃的温度系数意味着温度每变化1℃,阻值变化约0.01%,可有效抑制环境温度波动对电路性能的影响。例如在户外传感器信号调理电路中,即使温差达50℃,阻值变化也仅为0.5%,满足基本精度要求。

三、物理与环境适应性

3.1 封装与集成度

0402封装(英制0402,实际尺寸1.016mm×0.508mm)体积小巧,可大幅提升PCB板集成度,适配智能手机、智能穿戴等便携设备的高密度电路设计,减少板级空间占用。

3.2 宽温工作能力

-55℃~+155℃的工作温度范围覆盖工业级宽温需求,可在极端环境(如高温车间、低温户外)下稳定工作,无需额外散热或保温措施,降低系统设计复杂度。

3.3 厚膜工艺优势

采用厚膜印刷工艺制造,电阻膜层附着力强、抗磨损,长期工作可靠性高;同时成本优于薄膜电阻,适合大规模量产,平衡性能与成本。

四、典型应用场景

SC0402J3301F2ANRH的特性使其适配多类场景:

  1. 消费电子:智能手机、平板电脑的电源管理电路(如电池充放电控制)、音频滤波电路(如耳机接口信号衰减);
  2. 工业控制:小型传感器模块(温度、压力传感器)的信号调理电路、PLC输入输出接口的限流电路;
  3. 通信设备:基站射频前端的小型化匹配网络、光纤收发器的偏置电路(信维通信作为通信元器件供应商,产品兼容性强);
  4. 汽车电子:车载信息娱乐系统的小型控制电路(适配宽温环境)。

五、品牌与品质保障

信维通信具备完善的研发与生产体系,SC0402J3301F2ANRH通过严格可靠性测试:

  • 温度循环测试(-55℃~+155℃,1000次循环):阻值变化率≤0.5%;
  • 湿度测试(85℃/85%RH,1000小时):阻值变化率≤1%;
  • 符合RoHS 2.0环保标准,无铅无镉,满足绿色制造要求。

产品采用卷装(10k/盘)包装,支持自动化贴装,适合大规模生产,可稳定供应工业级需求。

该产品以高性价比、小型化与宽温特性,成为常规电子电路中替代同类进口电阻的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.