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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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SC0402J3301F2ANRH是信维通信(Sunway)针对高密度小型化电子电路推出的0402封装厚膜贴片电阻,核心参数精准匹配常规电路需求:标称阻值3.3kΩ、精度±5%、额定功率62.5mW、最大工作电压50V、温度系数±100ppm/℃,工作温度范围覆盖-55℃~+155℃,封装尺寸为0402(公制1.0mm×0.5mm)。该产品兼顾小型化、可靠性与成本优势,适合批量应用于消费电子、工业控制等领域。
标称阻值3.3kΩ,精度等级±5%(型号中“J”对应工业级±5%精度),无需额外校准即可满足常规电路的阻抗匹配、分压、限流需求。例如在电源滤波电路中,可稳定实现信号衰减,避免电压波动对后级电路的干扰。
额定功率62.5mW,最大工作电压50V。实际应用中需遵循功率-电压匹配原则((P=U^2/R)),确保工作电压不超过50V且功耗不超过额定值,避免电阻过热导致阻值漂移或损坏。
±100ppm/℃的温度系数意味着温度每变化1℃,阻值变化约0.01%,可有效抑制环境温度波动对电路性能的影响。例如在户外传感器信号调理电路中,即使温差达50℃,阻值变化也仅为0.5%,满足基本精度要求。
0402封装(英制0402,实际尺寸1.016mm×0.508mm)体积小巧,可大幅提升PCB板集成度,适配智能手机、智能穿戴等便携设备的高密度电路设计,减少板级空间占用。
-55℃~+155℃的工作温度范围覆盖工业级宽温需求,可在极端环境(如高温车间、低温户外)下稳定工作,无需额外散热或保温措施,降低系统设计复杂度。
采用厚膜印刷工艺制造,电阻膜层附着力强、抗磨损,长期工作可靠性高;同时成本优于薄膜电阻,适合大规模量产,平衡性能与成本。
SC0402J3301F2ANRH的特性使其适配多类场景:
信维通信具备完善的研发与生产体系,SC0402J3301F2ANRH通过严格可靠性测试:
产品采用卷装(10k/盘)包装,支持自动化贴装,适合大规模生产,可稳定供应工业级需求。
该产品以高性价比、小型化与宽温特性,成为常规电子电路中替代同类进口电阻的可靠选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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