Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SC0402J47R0F2ANRH是Sunway(信维通信)推出的一款小型化厚膜贴片电阻,采用0402封装,专为高密度电路设计,兼顾可靠性与成本优势,广泛适配消费电子、智能穿戴等领域的常规应用需求。
该电阻的核心属性可从基础属性和关键性能参数两方面明确:
该电阻在小型化、宽温可靠性及成本平衡上具备明显优势:
0402封装体积仅为1.0mm×0.5mm,可显著降低电路空间占用,适配智能手机、智能穿戴等便携式设备的高密度布局。
-55℃~+155℃的工作温度范围,使产品可在极端环境(如高温工业现场、低温户外场景)下稳定工作;±100ppm/℃的温度系数,确保阻值漂移控制在工程可接受范围内。
相比薄膜电阻,厚膜电阻成本更低,且具备较好的耐过载能力(短时间可承受1.5~2倍额定功率),长期使用可靠性高。
信维通信的自动化生产工艺确保产品阻值、温度系数等参数的批量一致性,减少电路调试复杂度。
SC0402J47R0F2ANRH的参数特性使其适配多领域的常规电路:
Sunway(信维通信)作为国内领先的电子元器件制造商,其产品具备完善的可靠性保障:
产品符合RoHS 2.0(无铅环保)、REACH(有害物质限制)等国际标准,满足出口及国内市场的合规要求。
通过多项行业标准测试:
符合IEC 61000-4(电磁兼容)、JIS C 5201(电阻器标准)等行业规范,可适配不同领域的应用要求。
为确保产品性能稳定,需注意以下要点:
采用回流焊工艺(避免手工焊接),遵循信维推荐的回流曲线:
存储于常温干燥环境(温度25℃±5℃,湿度40%~60%),避免长期暴露在高湿环境(湿度>85%)导致引脚氧化。
虽厚膜电阻抗静电能力优于薄膜,但组装过程中需采取ESD防护(接地工作台、防静电包装),避免静电损伤。
SC0402J47R0F2ANRH以其小型化、宽温可靠及成本优势,成为消费电子、智能穿戴等领域常规电路的理想被动元件选型。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products