WMSIC Electronic Components

Sunway SC0402F4991F2ANRH

ModelSC0402F4991F2ANRH
Package0402
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0402F4991F2ANRH
Type
SUNWAY
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0402F4991F2ANRH
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
4.99kΩ
Electronic Component
10
Electronic Component
BM0266080460
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Sunway SC0402F4991F2ANRH厚膜贴片电阻产品概述

Sunway(信维通信)推出的SC0402F4991F2ANRH是一款专为高密度电路设计的厚膜贴片电阻,凭借小体积、高精度、宽温稳定性等特点,广泛适配消费电子、物联网、汽车电子等领域的低功率电路需求。以下从核心参数、工艺特点、性能优势等维度展开详细概述。

一、产品核心参数解析

SC0402F4991F2ANRH的关键参数均针对通用电路设计需求优化,核心指标清晰可参考:

  • 阻值与精度:标称阻值4.99kΩ(对应代码“4991”,后两位“1”表示10¹倍),精度等级±1%,满足大多数信号调理、分压电路的精度要求;
  • 功率与电压:额定功率62.5mW,最大工作电压50V,在0402封装内实现了功率与电压的合理匹配,避免过压/过功率损坏;
  • 温度特性:温度系数(TCR)±100ppm/℃,即温度每变化1℃,阻值变化百万分之一百;结合-55℃~+155℃的宽工作温度范围,可稳定适配极端环境;
  • 封装规格:采用0402英制贴片封装(公制1005),尺寸为1.0mm×0.5mm,适合高密度PCB布局。

二、封装与工艺特点

  1. 0402小体积封装:0402封装是当前小型化电子设备的主流选择,体积仅为传统插件电阻的1/10左右,可显著提升PCB的集成度,适配智能手机、可穿戴设备等紧凑空间;
  2. 厚膜电阻工艺:采用厚膜丝网印刷工艺制备电阻膜层,相比薄膜电阻成本更低,且膜层附着力强、抗机械应力性能优异;Sunway针对该型号优化了膜层配方,进一步提升了温度稳定性与长期可靠性。

三、关键性能优势

  • 宽温稳定可靠:±100ppm/℃的温度系数结合-55℃~+155℃的工作范围,可覆盖汽车舱内高温、工业现场低温等场景,阻值漂移控制在合理区间;
  • 高精度适配通用需求:±1%的精度满足绝大多数信号放大、滤波、分压电路的设计要求,无需额外校准即可实现稳定输出;
  • 小体积高密度集成:0402封装支持PCB上密集布局,尤其适合多通道传感器、低功耗MCU周边电路等对空间敏感的设计;
  • 品牌品质保障:信维通信作为国内射频与电子元器件领域的龙头企业,该型号通过了AEC-Q200(汽车级)部分测试,品质一致性与可靠性符合行业标准。

四、典型应用场景

SC0402F4991F2ANRH的性能特点使其适配多领域低功率电路:

  1. 消费电子:智能手机、平板的信号调理电路(如射频前端分压、音频滤波)、可穿戴设备的传感器接口;
  2. 物联网设备:智能家居节点、低功耗传感器模块的信号放大与分压电路;
  3. 汽车电子:辅助驾驶系统的低功率控制电路(如摄像头周边信号调理)、车载信息娱乐系统的小信号处理;
  4. 工业控制:小型PLC的I/O接口滤波、电机驱动的电流采样电阻(低功率场景);
  5. 医疗设备:便携式血糖仪、血压计的信号调理电路,符合小型化与低功耗要求。

五、设计注意事项

为确保产品长期可靠工作,设计时需注意:

  1. 功率降额:在环境温度超过70℃时,需按125℃时降额至50%额定功率的标准使用,避免热失效;
  2. 焊接工艺:采用回流焊工艺时,需遵循0402封装的温度曲线(峰值温度230~245℃,时间≤40秒),避免焊接温度过高损坏电阻;
  3. 布局设计:避免在电阻周边布置高功率元件,防止局部过热影响阻值稳定性。

综上,Sunway SC0402F4991F2ANRH厚膜贴片电阻以小体积、高精度、宽温稳定为核心优势,是消费电子、物联网等领域小型化电路设计的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.