Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunway SC0402F4701F2ANRH
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunway SC0402F4701F2ANRH
- Type
- SUNWAY
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- SUNWAY
- Electronic Component
- SC0402F4701F2ANRH
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 4.7kΩ
- Electronic Component
- 10
- Electronic Component
- BM0266080459
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SC0420F4701F2ANRH 厚膜贴片电阻产品概述
一、产品基本定位与核心参数总览
SC0420F4701F2ANRH是信维通信（Sunway） 推出的0402封装厚膜贴片电阻，专为高密度贴装、低功率电路设计，核心参数覆盖通用精密电阻的典型需求。关键参数如下表：
参数类别 具体规格 电阻类型 厚膜贴片电阻 标称阻值 4.7kΩ（代码4701） 阻值精度 ±1% 额定功率 62.5mW（0.0625W） 额定电压（P≤62.5mW） ~17.5V（√(0.0625×4700)） 最大工作电压 50V（短时间过压） 温度系数（TCR） ±100ppm/℃ 工作温度范围 -55℃ ~ +155℃ 封装尺寸 0402（1.0mm×0.5mm）代码“4701”明确阻值（前三位470+第四位×10¹=4700Ω），便于库存管理。
二、封装与工艺特性
2.1 小尺寸0402封装
0402封装是贴片电阻高密度集成的典型代表，体积仅1.0mm×0.5mm（公制），比0603封装缩小约70%，可显著提升PCB板集成度，适配智能手机、可穿戴设备等空间严苛的终端。
2.2 厚膜工艺优势
采用氧化铝陶瓷基片+厚膜印刷烧结工艺：
- 基片：热稳定性强、绝缘性好，适配宽温区；
- 电阻膜：钌系浆料印刷后高温烧结，附着力强，抗机械应力优于薄膜电阻；
- 终端电极：银钯合金，兼容无铅回流焊/波峰焊。
厚膜工艺兼具成本可控与量产效率，适合通用阻值需求。
三、电气性能详细解析
3.1 精度与温漂控制
- ±1%精度：满足信号调理（分压、滤波、基准构建）的精准度，避免阻值偏差导致信号失真；
- ±100ppm/℃ TCR：温度每变1℃，阻值变化±0.47Ω；-55℃~+155℃范围内总变化≤±98.7Ω（约±2.1%），适配宽温场景。
3.2 功率与电压额定值
- 62.5mW额定功率：25℃下最大连续功耗，超此值会导致老化烧毁；
- 50V最大电压：短时间（脉冲）可承受上限，长期工作需控制电压≤17.5V（额定功率下的电压）。
四、环境适应性与可靠性
4.1 宽温区工作能力
覆盖**-55℃+155℃**，超出消费电子（0℃+70℃）需求，适配工业控制（-40℃+85℃）、汽车电子（部分低功率场景-40℃+125℃）。
4.2 长期可靠性验证
- 负载寿命：125℃下1000小时，阻值变化≤±0.5%（符合IEC 61061）；
- 环境应力：85℃/85%RH湿热测试1000小时、-55℃~+155℃循环1000次，阻值变化≤±1%；
- 焊接兼容：无铅回流焊（峰值245℃）无焊点脱落、膜层开裂。
五、典型应用场景
因小封装、低功耗、中等精度，广泛用于：
- 消费电子：手机音频滤波、可穿戴传感器分压；
- 小型工业：微型PLC电流采样、温度传感器放大；
- 低功率汽车：仪表盘背光控制、车载USB偏置；
- 物联网：智能门锁基准电压、环境监测模块偏置。
六、品牌与品质保障
信维通信（Sunway）为国内领先元器件厂商，该产品：
- 符合RoHS 2.0、REACH 环保标准，无铅无镉；
- 生产通过ISO 9001:2015 认证，批次一致性好；
- 提供完整测试报告与datasheet，支持工程选型验证。
该产品平衡了性能、成本与可靠性，是通用精密电路的高性价比选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
