WMSIC Electronic Components

Sunway SC0603F2002F2BNRH

ModelSC0603F2002F2BNRH
Package0603
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0603F2002F2BNRH
Type
SUNWAY
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0603F2002F2BNRH
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
20kΩ
Electronic Component
1
Electronic Component
BM0266065724
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0603F2002F2BNRH 厚膜贴片电阻产品概述

SC0603F2002F2BNRH是Sunway信维通信推出的0603封装厚膜贴片电阻,针对低功耗、高精度需求的电子电路设计,兼顾成本与性能,广泛适配消费电子、工业控制、汽车电子等多领域应用场景。

一、产品核心定位与典型应用

该电阻以“小体积、高精度、宽温适应性”为核心设计,主要面向对空间紧凑性要求高、阻值稳定性敏感的电路:

  • 消费电子:智能手机、平板电脑的电源管理模块(PMIC)、音频信号调理电路,利用0603封装节省PCB空间,±1%精度保证信号输出一致性;
  • 工业控制:传感器信号放大电路、PLC输入输出模块,宽温范围(-55℃~+155℃)适应车间高温或低温环境;
  • 汽车电子:仪表盘背光驱动、车载通信模块的辅助电路,满足汽车级对温度稳定性的要求;
  • 通信设备:基站射频前端的偏置电路,适配信维通信在通信领域的技术积累,性能匹配通信设备的可靠性需求。

二、关键性能参数深度解析

1. 阻值与精度

额定阻值为20kΩ±1%,1%精度属于厚膜电阻中的常规高精度等级,能够有效降低电路因阻值偏差导致的信号失真或电压波动。例如在12V电源分压电路中,20kΩ与10kΩ串联时,分压比误差控制在1%以内,满足大多数模拟电路的精度要求。

2. 功率与电压能力

最大耗散功率为100mW,工作电压上限为75V,符合0603封装厚膜电阻的典型功率规格,适合低功耗电路(如电池供电的便携式设备),避免因功率过载导致的电阻烧毁。

3. 温度系数(TCR)

温度系数为**±100ppm/℃**,即温度每变化1℃,阻值变化0.01%。以工作温度155℃(较室温25℃高130℃)为例,阻值最大变化量为130×0.01%=1.3%,结合初始±1%精度,总阻值误差控制在±2.3%以内,远优于一般厚膜电阻(TCR常为±200ppm/℃),提升了宽温环境下的性能稳定性。

4. 工作温度范围

覆盖**-55℃+155℃**,超出工业级标准(通常-40℃+85℃),可适应极端环境(如沙漠高温、极地低温),同时满足部分汽车级应用的温度要求(如发动机舱附近的高温场景)。

三、封装与工艺优势

1. 0603封装特性

采用英制0603封装(公制1608,尺寸1.6mm×0.8mm),体积小巧,适配高密度PCB设计,支持自动化贴装(SMT),生产效率高,降低组装成本。

2. 厚膜工艺核心

采用厚膜印刷烧结工艺:将电阻浆料(如钌基浆料)印刷在氧化铝陶瓷基片上,经高温烧结形成电阻膜,再通过激光微调阻值至目标精度。厚膜工艺兼具成本优势(低于薄膜电阻)和稳定性优势(高于碳膜电阻),适合大规模量产。

3. 端电极可靠性

端电极采用“镍底层+锡表层”三层结构,焊接时锡层熔融形成可靠焊点,镍层防止铜基片氧化,提升焊接强度与耐腐蚀性,符合IPC-A-610等电子组装标准。

四、可靠性与环境适应性

  1. 长期稳定性:厚膜电阻膜与陶瓷基片结合紧密,长期使用阻值漂移率通常小于0.1%/1000小时,满足产品生命周期内的性能要求;
  2. 耐湿热性能:符合IEC 60068-2-66湿热试验标准,在温度40℃、湿度95%RH环境下放置1000小时,阻值变化小于0.5%;
  3. 抗振动冲击:贴片封装无引脚,抗振动能力优于直插电阻,可承受10g(10~2000Hz)的振动测试,适合移动设备或工业振动环境。

五、品牌与品质保障

Sunway信维通信作为国内射频与电子元器件领域的龙头企业,SC0603F2002F2BNRH通过以下品质管控:

  • 环保认证:符合RoHS 2.0、REACH等欧盟环保标准,无铅无镉,适配绿色电子产品设计;
  • 批次一致性:每批次电阻均经过阻值、功率、温度系数等参数全检,一致性误差小于0.2%;
  • 售后支持:提供技术文档与应用方案,针对不同场景给出优化建议,保障客户项目顺利落地。

该电阻凭借“高精度、宽温适应、小体积、高可靠性”的综合优势,成为多领域电子电路设计的优选元件,尤其适合对成本敏感但性能要求稳定的应用场景。

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