Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Sunway SC1206J1504F8ANRH
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Sunway SC1206J1504F8ANRH
- Type
- SUNWAY
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- SUNWAY
- Electronic Component
- SC1206J1504F8ANRH
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.023g
- Electronic Component
- 1.5MΩ
- Electronic Component
- 1
- Electronic Component
- BM0266065773
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SC1206J1504F8ANRH 厚膜贴片电阻产品概述
SC1206J1504F8ANRH是信维通信（Sunway） 推出的一款通用型厚膜贴片电阻，采用1206（3216公制）标准封装，针对中低功率电路的精准阻抗匹配、分压限流等需求设计，兼具稳定性与成本优势，广泛适配消费电子、工业控制等多领域应用。
一、产品基本属性
该电阻属于厚膜贴片电阻类别，通过丝网印刷厚膜电阻浆料于陶瓷基底并烧结而成，工艺成熟且成本可控。型号中“SC”为信维通信产品前缀，“1206”代表封装尺寸，“J”对应精度±5%，“1504”表示阻值1.5MΩ（15×10⁴Ω），“F8ANRH”为信维内部规格编码，涵盖温度系数、功率等级等参数定义。
二、核心性能参数
作为通用型电阻，其核心参数覆盖主流电路设计需求：
- 阻值与精度：标称阻值1.5MΩ，精度±5%（J档），满足多数工业与消费类电路的阻抗误差要求；
- 功率与电压：额定功率250mW，最大工作电压200V，可稳定承载中低功率信号与直流/交流电路；
- 温度特性：温度系数±100ppm/℃，即温度每变化1℃，阻值变化约0.015kΩ（1.5MΩ×100ppm），在宽温范围内保持阻值稳定性；
- 工作温度范围：-55℃至+155℃，适配高低温环境下的设备运行（如户外通信设备、工业传感器）。
三、封装与物理特性
采用1206封装（英寸制，对应公制3216，即3.2mm×1.6mm），符合贴片元件的自动化贴装标准，厚度约0.55mm（典型值），适配多数PCB板的布线密度需求。陶瓷基底具备良好的热传导性，可快速散发电功率损耗，避免局部过热；表面电极采用镍/锡镀层，焊接兼容性强，支持回流焊、波峰焊等常规贴片工艺。
四、典型应用场景
因参数适配性广，该电阻可用于以下场景：
- 消费电子：智能手机、平板的电源管理电路（分压检测、限流保护）、音频电路（阻抗匹配）；
- 工业控制：PLC模块、传感器信号调理电路（信号分压、滤波阻抗）；
- 通信设备：基站射频电路的辅助阻抗匹配、电源滤波网络；
- 汽车电子：车载中控的小功率信号电路（需满足宽温要求）。
五、可靠性与环境适应性
厚膜工艺赋予其良好的稳定性：
- 耐温性：工作温度范围覆盖工业级标准，可承受短期高温冲击（如焊接过程的260℃回流焊）；
- 抗湿性：陶瓷基底与封装结构具备一定抗潮性，符合IEC 60068等可靠性测试标准；
- 长期稳定性：经老化测试后阻值漂移率低，适合对长期可靠性有要求的设备。
六、品牌与生产背景
信维通信（Sunway）是国内射频与被动元件领域的头部厂商，具备从浆料研发到封装生产的全链条能力，其厚膜电阻产品通过ISO 9001、IATF 16949等认证，广泛应用于华为、小米、三星等品牌的终端产品中。SC1206J1504F8ANRH作为其通用型产品线成员，兼具性能与性价比，是替代进口同类产品的可靠选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
