WMSIC Electronic Components

Sunway SC0805F20R0F4ANRH

ModelSC0805F20R0F4ANRH
Package0805
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0805F20R0F4ANRH
Type
SUNWAY
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0805F20R0F4ANRH
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.028g
Electronic Component
20Ω
Electronic Component
1
Electronic Component
BM0266065722
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0805F20R0F4ANRH 贴片厚膜电阻产品概述

一、产品基本定位

SC0805F20R0F4ANRH是信维通信(Sunway)推出的0805封装厚膜贴片电阻,定位于中精度、宽温域的通用型基础元器件。该产品兼顾成本可控性与性能稳定性,适用于对阻值一致性、温度漂移要求较高,且工作环境温度变化较大的电子电路场景,是消费电子、工业控制、通信设备等领域的主流选型之一。

二、核心技术参数详解

该电阻的性能参数清晰明确,可满足多数常规及部分严苛场景的设计需求,关键参数如下:

  1. 阻值与精度:标称阻值20Ω,精度等级±1%——实际生产阻值范围为19.8Ω~20.2Ω,可稳定支撑信号分压、阻抗匹配等对阻值一致性要求较高的电路;
  2. 功率与电压:额定功率125mW(对应0805封装常用的1/8W等级),最大工作电压150V——电路设计需注意功率/电压降匹配(如150V工作时电流需≤0.83mA,避免超功率);
  3. 温度特性:温度系数(TCR)±100ppm/℃——每变化1℃,阻值漂移量为20Ω×100×10⁻⁶=0.002Ω,宽温域下阻值稳定性优异;
  4. 工作温度范围:-55℃~+155℃——覆盖工业级、部分汽车级场景,可适应低温存储、高温运行的极端环境。

三、封装与物理特性

  1. 封装类型:采用0805表面贴装封装(典型尺寸:2.0mm×1.25mm×0.5mm),完全兼容SMT生产线,支持回流焊、波峰焊等主流焊接工艺,适配高密度电路板设计;
  2. 厚膜电阻结构:基于氧化铝陶瓷基片,通过丝网印刷钌基厚膜电阻浆料形成电阻体,再经电极化、环氧树脂保护层涂覆制成——厚膜工艺兼具成本优势与机械稳定性,电阻体与基片结合牢固,抗应力能力优于薄膜电阻。

四、典型应用场景

该电阻的性能参数匹配多领域需求,核心应用方向包括:

  1. 消费电子:手机、平板、智能穿戴的信号调理电路(音频分压、触控传感器匹配)、小型LED驱动限流;
  2. 工业控制:传感器信号处理(温度传感器分压校准)、小型PLC输入输出接口、电机驱动辅助限流;
  3. 通信设备:基站、路由器的射频阻抗匹配(信维通信通信领域技术积累适配高频特性)、电源滤波电路;
  4. 汽车电子:车载传感器(胎压监测、温度传感)辅助电路、中控小功率电源模块(宽温域覆盖部分车载场景);
  5. 医疗设备:血糖仪、血压计的信号放大电路、电源稳压限流。

五、可靠性与环境适应性

  1. 宽温稳定性:-55℃~+155℃范围配合±100ppm/℃ TCR,极端温度下阻值漂移可控,避免电路性能波动;
  2. 功率降额可靠性:125mW额定功率在0805封装中属于较高等级,若电路设计降额至70%(≤87.5mW),可显著提升长期可靠性;
  3. 环保认证:符合RoHS 2.0、REACH指令,无铅无镉,适配绿色电子设计;通过ISO 9001认证,批量供货一致性好。

六、品牌与选型建议

信维通信是国内领先的通信元器件提供商,在被动元器件领域拥有成熟研发生产能力,该产品供货稳定、参数一致性优异。

选型参考:若需更高精度(±0.1%)或更低TCR(±50ppm/℃),可换薄膜电阻;若需1/4W大功率,选0805高功率型号;若电压超150V,需更换高电压等级电阻。

该产品以平衡的性能与成本,成为多领域电路设计的可靠基础元器件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.