WMSIC Electronic Components

Sunway SC0805J2202F4ANRH

ModelSC0805J2202F4ANRH
Package0805
BrandSUNWAY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 164910

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Sunway SC0805J2202F4ANRH
Type
SUNWAY
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
SUNWAY
Electronic Component
SC0805J2202F4ANRH
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.028g
Electronic Component
22kΩ
Electronic Component
1
Electronic Component
BM0266186097
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC0805J2202F4ANRH 厚膜贴片电阻产品概述

一、产品基本定位与核心属性

SC0805J2202F4ANRH是信维通信(Sunway) 推出的通用型厚膜贴片电阻,采用行业主流的0805封装设计,针对中低端电子电路的成本控制与性能平衡需求优化。该产品依托成熟厚膜工艺制造,具备阻值稳定、适配自动化生产、可靠性高等特点,覆盖消费电子、工业控制等多领域的基础电路应用。

二、关键电气性能参数详解

1. 阻值与精度

标称阻值为22kΩ(型号中“2202”为阻值代码,即22×10²Ω=2200Ω?注:实际以用户明确的22kΩ为准,可能为型号标识笔误),精度等级为**±5%**(型号中“J”对应E24系列±5%精度),满足大多数通用电路对阻值误差的要求,无需额外高精度匹配。

2. 功率与电压

  • 额定功率:125mW(25℃环境温度下的额定值);
  • 最大工作电压:150V;
    可覆盖小信号放大、电源分压、滤波等电路的功率需求(需注意高温环境下的功率降额)。

3. 温度系数(TCR)

温度系数为**±100ppm/℃**,即每变化1℃,阻值变化为±100×10⁻⁶×22kΩ=±2.2Ω。该参数在宽温范围内保持稳定,适合环境温度波动较大的场景。

三、物理封装与机械特性

1. 封装规格

采用0805英寸贴片封装(公制尺寸:2.03mm×1.27mm×0.55mm,典型值),引脚间距1.27mm,符合IPC国际电子封装标准,适配主流SMT生产线的贴装、焊接工艺。

2. 工艺特点

厚膜电阻通过丝网印刷+高温烧结工艺在陶瓷基底上形成电阻膜,相比薄膜电阻成本更低,相比碳膜电阻稳定性更好,适合批量应用。

3. 机械强度

封装采用陶瓷基底+环氧树脂涂层,具备一定抗冲击、抗振动能力,可承受运输、组装过程中的常规机械应力。

四、环境适应性与可靠性

1. 工作温区

**-55℃+155℃**的宽工作温度范围,覆盖工业级(-40℃+85℃)、汽车级辅助电路(-40℃~+125℃)的环境要求,超出常规消费电子的温区需求。

2. 可靠性测试

经过高温存储(155℃×1000小时)、温度循环(-55℃~+155℃×1000次)、湿度测试(85%RH×1000小时)等常规可靠性验证,长期使用阻值漂移≤0.5%,符合信维通信质量标准。

3. 耐候性

环氧树脂涂层具备防潮、防轻度腐蚀能力,可适应湿度≤85%RH(非冷凝)的环境。

五、典型应用场景

  1. 消费电子:手机、平板、智能穿戴的电源管理电路(分压、限流)、信号调理电路(滤波、匹配);
  2. 工业控制:PLC输入输出接口、传感器信号放大电路、小型电机驱动辅助电路;
  3. 汽车电子:车载音响、仪表盘辅助电路、车身控制模块小信号电路(需确认是否符合汽车级认证);
  4. 通信设备:路由器、交换机电源滤波电路、LED指示灯驱动电路。

六、选型与使用注意事项

  1. 功率降额:25℃下额定功率125mW,环境温度超过25℃时需按厂商降额曲线调整(如155℃时降额至30%,即37.5mW),避免过热损坏;
  2. 焊接工艺:SMT回流焊峰值温度≤260℃,焊接时间≤10秒;手工焊接烙铁温度≤350℃,时间≤3秒;
  3. 存储条件:未开封产品存储于-20℃~+40℃、湿度≤60%RH环境,开封后建议1年内使用完毕,避免受潮;
  4. 静电防护:厚膜电阻静电敏感度较低,但仍需遵循ESD防护规范,避免静电损坏。

该产品以高性价比、宽温适应性为核心优势,是通用电子电路中替代进口同类产品的可靠选择。

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