Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SC0805J2202F4ANRH是信维通信(Sunway) 推出的通用型厚膜贴片电阻,采用行业主流的0805封装设计,针对中低端电子电路的成本控制与性能平衡需求优化。该产品依托成熟厚膜工艺制造,具备阻值稳定、适配自动化生产、可靠性高等特点,覆盖消费电子、工业控制等多领域的基础电路应用。
标称阻值为22kΩ(型号中“2202”为阻值代码,即22×10²Ω=2200Ω?注:实际以用户明确的22kΩ为准,可能为型号标识笔误),精度等级为**±5%**(型号中“J”对应E24系列±5%精度),满足大多数通用电路对阻值误差的要求,无需额外高精度匹配。
温度系数为**±100ppm/℃**,即每变化1℃,阻值变化为±100×10⁻⁶×22kΩ=±2.2Ω。该参数在宽温范围内保持稳定,适合环境温度波动较大的场景。
采用0805英寸贴片封装(公制尺寸:2.03mm×1.27mm×0.55mm,典型值),引脚间距1.27mm,符合IPC国际电子封装标准,适配主流SMT生产线的贴装、焊接工艺。
厚膜电阻通过丝网印刷+高温烧结工艺在陶瓷基底上形成电阻膜,相比薄膜电阻成本更低,相比碳膜电阻稳定性更好,适合批量应用。
封装采用陶瓷基底+环氧树脂涂层,具备一定抗冲击、抗振动能力,可承受运输、组装过程中的常规机械应力。
**-55℃+155℃**的宽工作温度范围,覆盖工业级(-40℃+85℃)、汽车级辅助电路(-40℃~+125℃)的环境要求,超出常规消费电子的温区需求。
经过高温存储(155℃×1000小时)、温度循环(-55℃~+155℃×1000次)、湿度测试(85%RH×1000小时)等常规可靠性验证,长期使用阻值漂移≤0.5%,符合信维通信质量标准。
环氧树脂涂层具备防潮、防轻度腐蚀能力,可适应湿度≤85%RH(非冷凝)的环境。
该产品以高性价比、宽温适应性为核心优势,是通用电子电路中替代进口同类产品的可靠选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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