WMSIC Electronic Components

Slkor BV-FA05UCA

ModelBV-FA05UCA
PackageDFN1006-2
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor BV-FA05UCA
Type
SLKOR
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
BV-FA05UCA
Electronic Component
1
Package
DFN1006-2
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.35pF
Electronic Component
BM0230872020
Operating Temperature
55℃~+125℃
Voltage
22V
Electronic Component
IEC 61000-4-5;IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BV-FA05UCA 产品概述

一、产品概况

BV-FA05UCA 是 Slkor(萨科微)推出的一款单通道、双向低容抗静电/浪涌保护二极管,采用紧凑 DFN1006-2 封装,专为 5V 等低压系统的接口和信号线提供 IEC 61000-4-2(ESD)及 IEC 61000-4-5(浪涌)级别的保护。器件在遭受脉冲冲击时能快速钳位,保护下游电路免受瞬态过压损伤。

二、主要参数

  • 极性:双向
  • 反向工作电压 Vrwm:5V
  • 击穿电压(Vbr):8.5V(典型)
  • 钳位电压:22V @ Ipp 4.5A(8/20μs)
  • 峰值脉冲电流 Ipp:4.5A @ 8/20μs
  • 峰值脉冲功率 Ppp:100W @ 8/20μs
  • 反向漏电流 Ir:100nA(典型)
  • 结电容 Cj:0.35pF(低电容,适合高速信号)
  • 通道数:单路
  • 工作温度:-55℃ ~ +125℃
  • 封装:DFN1006-2(小体积)
  • 标称类型:ESD/浪涌保护

三、性能亮点

  • 低结电容(0.35pF):对高速数据线(如 USB2.0、差分信号)影响非常小,适合对信号完整性要求高的场合。
  • 双向保护:可对双极性瞬态(正/负)提供对称钳位,适用于数据线与双向供电线路。
  • 紧凑封装:DFN1006-2 小型化设计,便于在空间受限的接口板、移动设备和消费电子中布置。
  • 良好的浪涌/脉冲能力:100W (8/20μs) 的峰值功率和 4.5A 峰值脉冲电流,可应对常见的雷击诱发浪涌与工业脉冲冲击。

四、典型应用

  • USB(尤其 USB2.0)及其他 5V 接口保护
  • 串口、I2C、SPI、UART 等慢速或中速信号的接口防护
  • 移动设备、物联网终端、工业控制接口、测量仪表等需要抗 ESD/浪涌保护的场景
  • 较小 PCB 面积且对信号完整性有要求的应用

五、安装与热管理建议

  • 尽量将器件放置在被保护端口与 PCB 引入点之间,靠近连接器或信号进入点以减少走线感抗。
  • 使用短且宽的接地回流路径,必要时在器件附近增加过孔(vias)引到大地平面以降低寄生电感。
  • DFN 封装建议按厂商推荐的 PCB 焊盘和回流工艺焊接,避免过度热应力并确保可靠焊点。
  • 在高能量冲击环境下,应与其他保护元件(如熔断器、慢熔保险等)配合使用,以实现系统级保护。

六、选型与注意事项

  • 钳位电压 22V 在保护多数 5V 器件时具有足够能力,但对极其敏感的低压器件(例如某些 ADC、传感器输入)仍需评估通过钳位后的容忍能力。
  • 双向结构适合信号线或两端可能出现正负瞬态的应用;若仅需单向电源保护,可考虑单向 TVS 以获得更低钳位电压。
  • 请参考实际工作环境的 ESD/浪涌等级选择器件数量与布局,必要时做实测验证(如 IEC 标准试验)以确认保护效果。

如需原理图封装库、推荐 PCB 焊盘尺寸或更详细的电气特性曲线(如钳位 vs. 电流、漏电随温度变化曲线),可提供具体资料以便补充。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.