WMSIC Electronic Components

Slkor 1N4007WS

Model1N4007WS
PackageSOD-323
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor 1N4007WS
Type
SLKOR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
1N4007WS
Electronic Component
1
Package
SOD-323
Electronic Component
General Purpose Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0230872015
Current
300mA
Diode
Electronic Component
Current(Ir)
25nA@20V
(Vf)
1.25V@150mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
300V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N4007WS 产品概述

一、产品简介

1N4007WS 是 Slkor(萨科微)出品的一款通用整流二极管,独立式封装,采用 SOD-323 小体积封装设计。该器件针对低功耗、小尺寸电子设备的整流与保护应用而优化,具有低反向漏电和稳定的正向压降特性,适用于表贴装配线生产。

二、主要电气参数

  • 正向压降(Vf):1.25V @ 150mA
  • 直流反向耐压(Vr):300V
  • 整流电流(IF):300mA(连续)
  • 反向电流(Ir):25nA @ 20V
    这些参数表明器件在中等电压、弱至中等电流工况下能提供可靠整流性能,反向漏电小,适合对泄漏有一定要求的应用。

三、封装与热特性

SOD-323 小型贴片封装,适合高密度 PCB 布局。由于封装尺寸小,热阻相对较高,长时间工作在额定整流电流时需注意散热:建议在 PCB 走铜厚或加热区扩展铜箔、避免连续满载工况,或在设计中采取间歇工作策略以控制结温。

四、典型应用场景

  • 电源整流与滤波(小功率适配器、备用电源)
  • 反向极性保护(便携设备、移动终端)
  • 开关电源的次级整流与续流需求(中低电流)
  • 信号去耦、钳位保护及其它通用整流/保护电路

五、设计与布局建议

  • 推荐在焊盘处保留合适的隔热铜箔以提高散热能力,避免在高热源下近距离布置敏感器件。
  • 若电路需要长期 300mA 工作,应评估结温并适当降额;短时冲击电流可通过脉冲容限评估。
  • 对于需要低反向泄漏的应用,尽量在工作电压接近额定 Vr 时注意温升对 Ir 的影响。

六、可靠性与储存

器件为无铅可回收焊盘兼容型封装,建议遵循常规元件储存规范:防潮密封包装、干燥箱保管。焊接前请确认元件的干燥箱开放时间(MSL 要求)并按回流曲线控制温度峰值,避免超温引起封装应力或性能退化。

七、替代与选型提示

在需要更高电流或更高耐压时,应选择更大封装或不同型号;若需更低正向压降或更高耐压,可参考厂方其他系列或同类器件。选型时以最大工作电压、平均整流电流及热管理能力为主要考量。

品牌:Slkor(萨科微)
封装:SOD-323
适用场景:小功率整流、保护与通用电子设备

如需器件的详细封装尺寸图、回流焊曲线或完整电气特性表,请提供联系方式或索取 Slkor 官方数据手册,以便获得完整规范参数和推荐的 PCB 尺寸。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.