WMSIC Electronic Components

Slkor BAT54S

ModelBAT54S
PackageSOT-23
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor BAT54S
Type
SLKOR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
BAT54S
Electronic Component
1
Package
SOT-23
Electronic Component
Schottky Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0226546163
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
1V@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54S(Slkor 萨科微)肖特基二极管 — 产品概述

一、产品简介

BAT54S 是 Slkor(萨科微)推出的一款小封装肖特基二极管,采用 SOT-23 封装,适合空间受限的表面贴装应用。该器件以低正向压降、低反向泄漏和快速恢复特性为主,适用于低电压快恢复整流、保护和信号整形等应用场景。基于您提供的参数:正向压降 Vf = 1V @ 100mA、非重复峰值浪涌 Ifsm = 600mA、反向耐压 Vr = 30V、反向电流 Ir = 2μA @ 25V、整流电流 If(AV) = 200mA。

二、主要电气参数

  • 正向压降(Vf):1.0V @ 100mA(随着电流降低,Vf 会相应下降;高温下 Vf 进一步降低)
  • 直流正向整流电流:200mA(连续工作极限,需考虑散热)
  • 非重复峰值浪涌电流(Ifsm):600mA(用于短时浪涌,按厂方说明的冲击波形和时长评估)
  • 直流反向耐压(Vr):30V(最大反向电压)
  • 反向电流(Ir):2μA @ 25V(低泄漏,适合电池与低功耗电路)
  • 封装:SOT-23(小型三引脚表贴)

三、产品特点

  • 低正向压降:在中小电流范围内具有较低的压降,有助于减小整流或保护回路的功率损耗。
  • 低反向泄漏:2μA @ 25V 的反向电流在许多电源管理与电池供电电路中表现良好。
  • 良好的浪涌承受力:600mA 的非重复峰值浪涌能力可应对短时突发冲击。
  • 小体积封装:SOT-23 便于紧凑型电路设计与自动贴片生产。
  • 快速开关特性:肖特基势垒结构带来快速响应,适合高频开关环境下的整流与钳位。

四、典型应用

  • 反向极性保护与输入保护二极管(在低压系统做方向保护或防反接)
  • 小功率整流:如 5V/3.3V 辅助电源的低电流整流与续流路径
  • 电源轨 ORing 与隔离(多电源自动切换)
  • 钳位与吸收电路(防止电压尖峰)
  • 信号恢复与电平移位(需要注意 Vf 对低电平信号的影响)
  • 便携设备、传感器节点、消费电子与通信设备中的低功耗电路

五、使用与布板建议

  • 散热:SOT-23 封装散热能力有限。连续 200mA 工作时需通过优化 PCB 铜箔面积(尤其是焊盘和接地层)来降低结到环境热阻。按经验,标准 PCB 上 RθJA 受布局影响较大,必要时增加散热铜箔或内层热通孔。
  • 封装取向与焊盘:严格按照厂方数据手册的管脚定义与焊盘建议设计 PCB,保证焊接可靠性与热传导。
  • 浪涌保护:Ifsm 为非重复峰值能力,不能作为重复冲击设计依据。若电路存在频繁浪涌,应选用更高浪涌或额外抑制元件(如 TVS)。
  • 工作电压与温度:反向耐压为 30V,超出该电压可能导致击穿。高温下反向电流会增加,需在高温场景核算漏电对系统的影响。

六、可靠性与测试要点

  • 在生产验证阶段进行温升、长期老化、浪涌与循环温度试验,确认在目标工况下的稳定性。
  • 对关键参数(Vf、Ir)在不同温度与不同电流点进行采样,以建立电路的最坏情况边界。
  • 建议在产品开发阶段保留一定裕量,例如将持续工作电流设计在整流电流额定值之下,以延长寿命并降低故障风险。

七、封装与订购信息

  • 封装形式:SOT-23(表面贴装)
  • 品牌:Slkor(萨科微)
  • 型号:BAT54S(请以厂家完整料号和数据手册为准,确认封装引脚定义与双管/单管配置)
  • 合规:选购时建议确认 RoHS 与相关可靠性认证以满足最终产品要求。

以上为基于您提供参数整理的 BAT54S 产品概述与工程注意事项。实际设计中请以 Slkor 提供的官方数据手册为最终依据,必要时与供应商确认器件的封装脚位和具体测试条件。

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