Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Slkor ABS210
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Slkor ABS210
- Type
- SLKOR
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SLKOR
- Electronic Component
- ABS210
- Electronic Component
- 1
- Package
- ABS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Electronic Component
- BM0264567858
- Current
- 2A
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1V@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ABS210 产品概述
ABS210 是一款由 Slkor（萨科微）推出的高性能整流桥，专为满足各种中高功率电源应用而设计。其出色的电气参数、广泛的工作温度范围及可靠的长期稳定性，令其在市场上备受青睐。以下将详细介绍该产品的关键指标和应用场景。
关键技术参数
反向电流 (Ir): 该整流桥在1kV的条件下反向电流为5微安（5uA），这表明其具有非常低的漏电流，可以有效提升电能的转换效率和可靠性，适合长时间工作在高电压环境中。
整流电流: ABS210的整流电流达到2安培（2A），适合多种电源供电需求，此特性使其能够在电流负载较大的应用中稳定工作。
正向压降 (Vf): 在2A的工作条件下，ABS210的正向压降为1伏特（1V）。这一较低的压降保证了在整流过程中能量损失最小化，提高了整流效率。
正向浪涌电流 (Ifsm): 该整流桥的正向浪涌电流可达到50安培（50A），使其能够承受瞬时高电流冲击，这在许多电源应用中是至关重要的，例如电机启动、瞬态过载等场景。
直流反向耐压 (Vr): ABS210具备1kV的反向耐压能力，允许其在高电压环境中安全操作，这为高电压电源设备和电力电子产品提供了稳定可靠的整流解决方案。
工作温度范围: ABS210的工作温度范围为-55℃至+150℃，可适用于极端环境运动和高温操作，满足不同应用领域的需求。
应用场景
ABS210整流桥因其卓越的性能特征，广泛应用于以下领域：
电力供应设备: 由于其高电压耐受能力和低正向压降，ABS210适用于DC-DC转换器、开关电源等电力电子产品。
工业自动化: 在一些自动化设备及控制系统中，ABS210能够提供稳定的直流电源，确保系统的正常运作。
电动机驱动: 在电动机控制系统中，ABS210可支持高浪涌电流的应用，具有良好的瞬态响应特性，以应对电动机启动时的瞬时负载。
通信设备: 对于需要稳定电源的通信设备，ABS210提供可靠的整流功能，确保设备长期稳定运行。
汽车电子: 在汽车电子系统中，ABS210可应用于电源转换模块，确保车辆电气系统在各种环境条件下的可靠性和稳定性。
特点与优势
高可靠性: 由于其低反向电流和优异的长期稳定性，ABS210能够保障设备在不同工作条件下的可靠性。
耐高温与极端环境: 宽广的工作温度范围使其适应于极端气候和恶劣环境的应用，能有效降低因温度过高或过低导致的故障风险。
易于集成: ABS210设计紧凑，方便集成在不同类型的电路板中，降低了设计和制造的复杂性。
结论：ABS210整流桥凭借其出色的电气特性和广泛的适用性，为各类电子设备提供了坚实的电源管理解决方案。无论是在工业、通信还是汽车等领域，ABS210都能够发挥其优异的性能，为设备的高效和稳定运行保驾护航。选择ABS210，将是您在电源设计与应用中的明智之选。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
