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Slkor DB207S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Slkor DB207S
- Type
- SLKOR
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SLKOR
- Electronic Component
- DB207S
- Electronic Component
- 1
- Package
- DBS
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.555g
- Electronic Component
- 1
- Electronic Component
- BM0226546186
- Current
- 2A
- Current(Ir)
- 10uA@1kV
- (Vf)
- 1.1V@2A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DB207S 产品概述
一、概述
DB207S 为单相整流桥（单相全波），由四只硅整流二极管组成，适用于中高压直流整流场合。品牌：Slkor（萨科微），封装：DBS。该器件在工业级结温范围内工作可靠，适配多种电源及高压整流系统。
二、主要性能参数
- 工作结温范围：-55℃ ~ +150℃
- 直流反向耐压（Vr）：1000 V
- 正向压降（Vf）：1.1 V @ IF = 2 A
- 持续整流电流：2 A
- 非重复峰值浪涌电流（Ifsm）：60 A
- 反向电流（Ir）：10 μA @ Vr = 1 kV
- 类型：单相整流桥
上述参数表征了在额定条件下的核心电气性能，特别是在高压工况下的反向耐压与低反向漏电流，使其适合高压直流设备的整流任务。
三、结构与封装
DB207S 采用 DBS 封装，结构紧凑，有利于在PCB上完成桥式整流布局。器件由四只二极管形成桥式连接，两个交流端（~）输入，正负输出分别为 +、-。封装便于波峰/回流焊接与机械安装，适合标准表面贴装或通孔混合工艺（请参照完整封装图纸与焊接规范）。
四、典型应用场景
- 交流到直流的电源模块与整流电路
- 高压电源、测量设备与高压驱动电源
- 工业控制、电机驱动前端整流
- 充电与充电站电源前端（视系统要求作降额）
- 各类需耐高压、漏电小的整流场合
五、设计与使用建议
- 散热：尽管额定整流电流为2 A，长时间工作时应通过扩大PCB散热铜箔或加装散热片降低结温，避免靠近150℃上限长期运行。
- 冲击电流：Ifsm = 60 A 可处理短时冲击，但仍建议在电路中加入浪涌抑制（如限流器、NTC、熔断器或TVS）以提高可靠性。
- 漏电流与高压应用：反向漏电仅 10 μA@1 kV，适用于高压场合，但高压系统仍需良好绝缘与爬电距离设计。
- 布局：交流输入端与滤波电容应尽量靠近器件，走线宽且短，减小寄生电感与发热集中。
- 降额：在高温或散热受限条件下建议对额定电流进行降额处理（参考系统热设计）。
六、可靠性与测试要点
推荐在设计验证阶段进行峰值浪涌测试、长期老化和高温存储/循环试验以确认在目标工况下的稳定性。高压应用应增加绝缘与耐压测试，关注反向漏电随温度上升的变化。
七、采购与替代
DB207S 由 Slkor（萨科微）出品，购买前请确认封装标识与测试报告。若需替代器件，应匹配关键参数：Vr≥1kV、Ifsm≥60A、整流电流约2A及相近的正向压降与结温范围。
备注：本文基于给定关键参数编写，更多电气特性、封装尺寸与焊接曲线请参阅厂家完整数据手册以便于最终设计验证。
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