WMSIC Electronic Components

Slkor TL431A

ModelTL431A
PackageSOT-23
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor TL431A
Type
SLKOR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
TL431A
Electronic Component
1
Package
SOT-23
Electronic Component
Voltage Reference IC
Electronic Component
±0.5%
Electronic Component
0.033g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0227307366
Operating Temperature
0℃~+70℃
Operating Voltage
2.5V~37V
Electronic Component
50ppm/℃
Output Voltage
2.5V~36V
Output Current
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TL431A 可调电压基准(Slkor/萨科微,SOT-23)

一、产品简介

TL431A 是一款高精度可调式并联(分流)型电压基准与误差放大器,品牌为 Slkor(萨科微),SOT-23 封装。器件在 0℃+70℃ 工作温度范围内稳定工作,提供可调输出电压范围 2.5V36V,适用于各种需要精密基准和反馈控制的电源与检测场合。

二、主要参数(关键指标)

  • 输出类型:可调分流式(可做可调精密齐纳替代品)
  • 基准电压起点:2.5V
  • 可调输出范围:2.5V ~ 36V
  • 工作电压范围:2.5V ~ 37V
  • 最大输出/分流电流:100mA
  • 最小阴极电流以维持调节:450 μA
  • 精度(初始容差):±0.5%
  • 温度系数:50 ppm/℃(典型值)
  • 工作温度:0℃ ~ +70℃
  • 封装:SOT-23

三、功能特点与优势

  • 高精度:±0.5% 初期精度,配合低温漂(50 ppm/℃)可用于对稳压精度要求较高的电路。
  • 宽电压、宽电流范围:2.5V~36V 的输出范围和最高 100mA 分流能力,能满足多数模拟和开关电源反馈回路需求。
  • 可替代可调齐纳二极管:在需要可调、精密基准的场合(如参考源、比较器、欠压保护)表现优异。
  • 小封装:SOT-23 适合空间受限的应用。

四、典型应用场景

  • 开关电源反馈基准与误差放大器(隔离电源二次侧反馈)
  • 可调精密稳压电路与基准源
  • 过压/欠压检测、参考阈值比较器
  • 电池充电/恒流、恒压控制中的参考与放大元件
  • 可编程电流源与模拟电路校准

五、典型电路与使用要点

  • 基本设定公式(忽略参考端小电流误差):Vout ≈ Vref × (1 + R1/R2),其中 Vref 为内部基准 2.5V。实际设计时应考虑参考端电流带来的误差并选取合适阻值。
  • 保证最低阴极电流:为维持输出精度与调节,系统在任何状态下应保证流过器件的阴极电流不低于 450 μA。若工作电流接近上限,应核算器件的功耗。
  • 稳定性与旁路:在某些负载和 PCB 布局下,TL431A 与并联输出电容可能产生振荡。常见做法是在 REF 与阴极间并联一个小电容(数十 nF)或使用 RC 补偿网络以改善相位裕度。
  • 功耗与散热:器件功耗为 Pd = (Vin - Vout) × Ik(Ik 为阴极电流)。SOT-23 封装散热能力有限,需避免长时间在高压差与大电流条件下工作,以防过温。
  • 电阻精度选择:若要求系统整体误差小于 1%,建议使用高精度分流电阻(0.1%~0.5%)并注意温漂匹配。

六、封装与选型建议

SOT-23 小体积便于 PCB 高密度设计。选型时注意额定电流与功耗余量,若电压差较大且分流电流接近 100mA,应考虑采用散热更好的封装或外加散热元件,或使用功率较高的替代方案。

七、总结

Slkor(萨科微)TL431A 在 0℃~+70℃ 工作条件下,以 ±0.5% 初始精度、50 ppm/℃ 的低温漂和最高 100mA 分流能力,提供了小体积且精密的可调参考解决方案。适合用于电源反馈、检测保护与精密基准场景。设计时重点关注最低阴极电流、器件功耗与稳定性补偿,以保障长期可靠性与精度。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.