WMSIC Electronic Components

Slkor SL20162712M6P

ModelSL20162712M6P
PackageSMD2016-4P
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor SL20162712M6P
Type
SLKOR
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
SL20162712M6P
Electronic Component
1
Package
SMD2016-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.03g
Frequency
27.12MHz
Electronic Component
1
Electronic Component
BM0227676393
Operating Temperature
20℃~+70℃
Electronic Component
±10ppm
Load Capacitor
6pF
Electronic Component
Electronic Component
Electronic Component
3000
Resistor(ESR)
60Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SL20162712M6P 产品概述

一、产品简介

SL20162712M6P(品牌:Slkor/萨科微)是一款表贴型晶体谐振器,中心频率为27.12MHz,适用于对频率稳定性和尺寸有严格要求的便携及消费类电子设备。本型号采用SMD2016-4P小尺寸封装,面向无线遥控、射频参考源、时钟产生及低功耗振荡电路等应用场景。

二、主要特性

  • 标称频率:27.12MHz
  • 常温频差:±10ppm(25℃指标)
  • 负载电容:6pF(设计时按目标电路负载配比)
  • 等效串联电阻(ESR):60Ω(典型值)
  • 工作温度范围:-20℃ ~ +70℃
  • 封装:SMD2016-4P(约2.0 × 1.6 mm)
  • 适用于贴片回流工艺,便于小型化布局

三、性能解读与影响

  1. 频差(±10ppm):表示在常温下的初始频率偏差,对高精度定时或频率合成应用需考虑补偿或调谐。
  2. 负载电容6pF:为实现标称频率,外部谐振回路应匹配该负载值;实测电路中存在走线及管脚寄生电容,应据此调整外接电容。
  3. ESR 60Ω:较高的等效阻抗意味着驱动放大器需具备足够增益与驱动能力,否则可能出现起振缓慢或无法起振的情况。

四、典型电路与选型建议

  • 建议使用传统Pierce晶体振荡器结构,外接电容C1、C2对称。按照公式 CL = C/2 + Cstray 估算,若系统寄生电容约2–3pF,可选C1=C2≈6.8pF~8.2pF。
  • 选择振荡器/放大器时,注意其驱动电平与允许晶体驱动功率,避免过驱动导致频率漂移或晶体损伤。
  • 若应用在温度变化较大的环境,考虑使用温度补偿或更宽温区器件。

五、封装与贴装注意事项

  • 封装SMD2016,布局时晶体引脚与地的走线应尽量短、对称,避免大面积金属或强电流走线靠近,以减少寄生干扰。
  • 回流焊接建议采用无铅焊接曲线(峰值温度不超过260℃并控制时间),焊接后建议进行功能验证以排除焊接应力引发的频差变化。

六、储存与可靠性

  • 存放环境建议干燥、无腐蚀性气体,避免长期暴露在高温高湿环境。
  • 产品在出厂前通常经过老化和筛选测试;在关键应用建议进行到板级的温度循环与振动可靠性验证。

七、常见问题与排查

  • 无法起振:检查驱动器增益与负载电容匹配,确认ESR是否过高以及焊接是否良好。
  • 频率漂移超标:核查外部负载电容、PCB寄生电容、工作温度是否在规格范围内;必要时调整补偿电容。
  • 焊接后频差变化:注意回流曲线与焊接工艺,避免过热或机械应力。

总结:SL20162712M6P以其小尺寸和良好的频率稳定性,适合对体积和频率精度有要求的射频及定时电路。设计时重点注意负载电容匹配、驱动等级以及合理的PCB布局与回流工艺,可确保器件达到最佳工作状态。若需更详细的电气特性曲线或可靠性数据,建议联系Slkor厂商获取完整数据手册。

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