Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Slkor BCP56-16 BCP56
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Slkor BCP56-16
- Type
- SLKOR
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SLKOR
- Electronic Component
- BCP56-16
- Electronic Component
- 1
- Package
- SOT-223-3
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.193g
- Electronic Component
- 1
- Electronic Component
- BM0226546150
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 1.5W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Collector Current(Ic)
- 1A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BCP56-16 产品概述
一、产品简介
BCP56-16 是 Slkor（萨科微）出品的一款中功率 NPN 双极型晶体管，采用 SOT-223-3 封装。器件支持最高集电极电流 1A、集电极-发射极击穿电压 80V，最大耗散功率 1.5W，适用于中等电流、较高电压的开关与放大场合。器件在高温工作点（结温可达 +150℃）仍保持良好性能，可靠性优良。
二、主要特性
- 直流电流增益 hFE ≈ 100（测量条件：Ic=150mA，VCE=2V），利于在中等电流范围取得稳定放大倍数。
- 转换频率 fT ≈ 100MHz，适合频率不太高的射频/驱动应用及快速开关场合。
- 集电极-发射极击穿电压 Vceo = 80V，可用于较高电压的电源管理和驱动电路。
- 最大集电极电流 Ic = 1A，适合中低功率负载驱动。
- 集电极截止电流 Icbo ≈ 100nA，漏泄小，有利于提高静态功耗表现。
- 集-射饱和电压 VCE(sat) ≤ 500mV（典型测量点：Ic=500mA, Ib=50mA），在开关导通时损耗可控。
- 发-基击穿电压 Vebo = 5V，注意基极驱动电压不宜超过此限制。
- 工作结温范围 -65℃ 至 +150℃（Tj），适用温度区间广。
三、典型应用
- 低中功率开关电源与电池管理电路。
- 马达驱动、继电器驱动及继电器阵列。
- 功率放大器前级与音频驱动电路。
- 通用驱动器、信号放大与缓冲应用。
- 工业控制与汽车电子（需按系统级热管理与电压浪涌保护设计）。
四、封装与热管理建议
SOT-223-3 封装相比小型封装具备更好的热性能，但 1.5W 的耗散仍要求合理的 PCB 散热处理：
- 在封装底部和引脚间区域扩展铜箔散热垫，建议增加多层过孔连接至内层或底层散热平面。
- 在长期大电流或高环境温度下，需评估结温并保证 Tj 不超过 150℃。
- 焊接工艺遵循厂家回流曲线，避免过热导致器件热损伤。
五、使用注意事项
- 基极-发射极击穿电压仅为 5V，应避免对基极施加过高的反向电压或大幅电流突变。
- VCE(sat) 在高电流时仍有一定压降，设计时考虑饱和损耗对系统效率的影响。
- 为保证开关速度与稳定性，驱动电阻与基极电流需按实际负载和所需开关时间计算。
- 在高压或感性负载驱动（如电机、线圈）时，必须添加适当的续流二极管或抑制网络，防止电压回击损伤器件。
六、采购与替代
BCP56-16 以其 80V/1A 的电气特性和 SOT-223 的良好散热能力适合批量制造与维修替换。选型时可根据具体功率、频率与封装要求比较同类 NPN 器件，必要时进行实测验证其增益、饱和电压与热阻等关键参数。
如需电气规格表、封装尺寸图或应用电路示例，可进一步提供，以便给出针对性的设计建议与布局优化。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
