WMSIC Electronic Components

Slkor IRFR5305

ModelIRFR5305
PackageTO-252
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor IRFR5305
Type
SLKOR
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
IRFR5305
Electronic Component
1
Package
TO-252
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.46g
Electronic Component
1
Electronic Component
BM0264567871
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
50W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V
Capacitor(Ciss)
2.535nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRFR5305 产品概述

一、主要参数

  • 类型:P沟道MOSFET(单只)
  • 漏源耐压 Vdss:60 V
  • 连续漏极电流 Id:30 A
  • 导通电阻 RDS(on):35 mΩ @ Vgs = 10 V
  • 耗散功率 Pd:50 W
  • 栅极阈值电压 Vgs(th):2.5 V
  • 总栅极电荷 Qg:46 nC @ 10 V
  • 输入电容 Ciss:2.535 nF
  • 反向传输电容 Crss:75 pF
  • 工作温度范围:-55 ℃ ~ +175 ℃
  • 品牌:Slkor(萨科微)
  • 封装:TO-252

二、关键特性

IRFR5305 采用先进沟槽结构和优化工艺,兼顾低导通损耗与适中的栅极驱动需求。35 mΩ 的RDS(on) 在10 V 驱动下可提供低导通压降,适合要求高电流且需要较低功耗的P沟道场合。46 nC 的总栅极电荷提示在高频切换时需要注意驱动能力和开关损耗。宽温度范围与较高的耗散功率使其在苛刻环境下也能保持稳定工作。

三、典型应用

  • 电源管理:高侧开关、ORing二极管替代、负载切换
  • DC-DC转换器中的同步整流/回路控制(作为高侧开关)
  • 电池保护与电源路径切换
  • 电机驱动与逆变器的保护电路
  • 工业与汽车电子(需注意符合车规认证要求)

四、使用与设计注意事项

  • 栅极驱动:P沟道在高侧应用可简化驱动电路,但要保证驱动器能提供足够的电压摆幅以快速充放电 46 nC 的栅电荷,避免慢速切换导致的过热和开关损耗增加。
  • 开关损耗:高频切换时需计算由 Qg 与 Vgs 变化带来的能量损耗,并选配合适驱动电流与驱动阻抗。
  • 噪声与稳定性:Crss 较小有利于降低米勒效应,但布局需尽量短而粗的栅、源、漏回流路径,减小寄生电感和环路面积。
  • 热设计:在高电流或持续导通场景下,需根据Pd=50 W 的热阻参数(结合实际PCB散热)进行散热设计,必要时加装散热片或增大铜箔面积。

五、封装与热管理

TO-252 封装兼顾小体积与良好热性能,适合表面贴装生产。为保证长期可靠性,建议在PCB上为封装引脚和底部散热片提供充足的铜层和通孔,以提升散热效率并降低结温。

六、总结

IRFR5305(Slkor)是一款面向高侧开关与电源管理的P沟道MOSFET,具有60 V 耐压、30 A 电流能力和较低的导通电阻。其低RDS(on) 和可接受的栅极电荷使其在中低频电源与负载切换应用中表现良好。设计时需关注栅极驱动能力与热管理,以发挥器件最佳性能并确保可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.