WMSIC Electronic Components

Slkor RS3M

ModelRS3M
PackageSMA
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor RS3M
Type
SLKOR
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
RS3M
Electronic Component
1
Package
SMA
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.102g
Electronic Component
1
Electronic Component
BM0264567873
Current
3A
Current(Ir)
100uA
(Vf)
1.3V@3A
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2000
Voltage Rating(Vr)
1kV

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS3M 快速恢复整流二极管产品概述

一、产品简介

RS3M 系列为 Slkor(萨科微)推出的表面贴装快速恢复整流器,适用于 50 V 至 1000 V 电压等级场合。器件采用 SMA 小外形封装,额定正向电流 3.0 A,针对开关电源、整流和续流等需要较快恢复特性的电路设计而优化。

二、主要电气参数

  • 正向压降(Vf):1.3 V @ 3 A
  • 直流反向耐压(Vr):最高可达 1 kV(系列覆盖 50 V~1000 V)
  • 最大整流电流:3 A
  • 反向漏电流(Ir):典型 100 μA(受温度与电压影响)
  • 反向恢复时间(Trr):约 500 ns
  • 工作结温范围:-50 ℃ ~ +150 ℃

三、产品特点

  • 快速恢复:Trr≈500 ns,减小开关损耗和电磁干扰(EMI)。
  • 高压范围覆盖广:适配多种电压等级的电源系统。
  • 小封装高可靠性:SMA 封装利于自动贴片生产,良好散热性能与机械强度。
  • 宽温度工作:适用于工业级环境与高温工作点。

四、典型应用

  • 开关电源(SMPS)整流与续流二极管
  • 逆变器与电机驱动的续流回路
  • 功率适配器、充电器及照明电源
  • 高压整流与电源保护电路

五、封装与热性能

SMA 表面贴装封装便于高速贴装与回流焊工艺,器件须保证良好的PCB散热铜箔面积以降低结温。工作结温不超过 150 ℃,建议在高电流应用中评估实际结-环境温升。

六、选型与使用注意事项

  • 选型时除考虑峰值反向电压外,应预留安全裕量(一般取器件Vr≥电路最高反向电压×1.25)。
  • 在高频开关场合注意 Trr 对 EMI 和功耗的影响,必要时考虑更低 Trr 的器件或加吸收网络。
  • 注意回流焊温度曲线与器件热阻,避免长期在额定极限附近工作以延长寿命。

七、订购信息与品牌

品牌:Slkor(萨科微);封装:SMA;产品型号:RS3M。订购时请核实完整型号与电压等级,获取最新规格书以确认参数与可靠性测试结果。若需样品或技术支持,可联系厂商或授权代理商。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.