Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Slkor CZT5551
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Slkor CZT5551
- Type
- SLKOR
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SLKOR
- Electronic Component
- CZT5551
- Electronic Component
- 1
- Package
- SOT-223-4
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.201g
- Electronic Component
- 1
- Electronic Component
- BM0264245694
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 1.5W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CZT5551 产品概述
一、产品简介
CZT5551是一款高性能的NPN型双极型三极管（BJT），其功率额定值为1.5W，耐压能力可达160V，最大集电极电流为600mA，采用SOT-223-4封装。这款三极管由知名电子元器件品牌Slkor（萨科微）制造，专为高电压和中等功率应用而设计。凭借其卓越的电气性能和高可靠性，CZT5551广泛应用于电源管理、信号放大以及开关电路等多个领域。
二、主要特点
高电压耐受能力：CZT5551的最高直流耐压可达到160V，使其能够在高电压电路中工作而不发生击穿，适合于电源转换和高压开关应用。
适中的功率处理：该三极管的最大功率额定为1.5W，确保其在各种应用中能够可靠工作，尤其适合于需要中功率控制的场景。
高电流输出能力：CZT5551能承受最大600mA的集电极电流，适用于驱动相对较大的负载，比如马达、继电器等。
紧凑封装：SOT-223-4封装使得CZT5551占用空间小，便于在电路板设计中集成，适合于要求严格的空间设计的现代电子设备。
高增益：这款三极管具有良好的电流增益特性，能够在低输入信号情况下实现较高的输出，有助于降低信号放大的难度。
三、应用领域
CZT5551的高耐压和高电流特性使其在多个领域得到了广泛应用：
电源管理：在开关电源或线性稳压电路中，CZT5551可用于电流放大，确保电源的稳定性和输出功率。
信号放大：作为信号放大的组件，CZT5551广泛应用于音频设备、传感器信号处理等领域，提升信号的强度。
开关应用：该三极管能够以较小的输入控制较大的电流，非常适合用于继电器驱动、LED驱动、电机开关等。
电气保护：在一些电路中，CZT5551可以作为保护元件使用，确保器件在异常情况下都能够保持稳定工作。
四、技术规格
- 部件类型：NPN型三极管
- 功率额定值：1.5W
- 最大集电极电流：600mA
- 直流耐压：160V
- 封装类型：SOT-223-4
- 增益（hFE）：在特定条件下可满足较高的增益需求
五、使用注意事项
散热设计：由于CZT5551具有一定的功耗，设计电路时应注意散热，以避免因过热导致性能下降或击穿。
极性连接：确保在电路中正确连接三极管的极性，避免损坏器件。
工作条件：建议在其规定的工作条件范围内使用，避免超出最大额定值，以确保稳定性和可靠性。
六、结论
CZT5551是一个集高耐压、高电流、优良热稳定性于一体的NPN型三极管，适合于各种高性能电子应用。其紧凑的SOT-223-4封装使其适合于现代电子设备的设计需求。通过合理应用CZT5551，工程师可以有效提升产品的性能和稳定性，使之在市场竞争中具有更强的竞争力。无论是在电源管理、信号放大，还是开关应用中，CZT5551都能展现出其出色的电气特性和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
