WMSIC Electronic Components

Slkor LM2596S-ADJ LM2596S

ModelLM2596S-ADJ
PackageTO-263-5
BrandSLKOR
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Slkor LM2596S-ADJ
Type
SLKOR
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SLKOR
Electronic Component
LM2596S-ADJ
Electronic Component
1
Package
TO-263-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
1.91g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0226543181
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~30V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM2596S-ADJ 产品概述

一、产品简介

LM2596S-ADJ 是一款降压型开关稳压器,面向中高功率点对点电源转换场景。基于降压拓扑、内置开关管设计,可提供最高3A的连续输出电流,开关频率约150kHz,适用于车载、电源模块和工业设备等需要高效率、体积受限的场合。器件封装为 TO-263-5(SMD),品牌信息参考 Slkor(萨科微)系列实现。

二、主要参数

  • 功能类型:降压型(Buck)
  • 输入电压:4.5V ~ 30V(部分衍生型号对更高输入耐压可达40V)
  • 输出电压:可调,典型基准电压约1.23V(规格范围参考1.193V~1.267V),可调至30V
  • 最大输出电流:3A(连续)
  • 开关频率:150kHz(典型)
  • 静态电流(Iq):约2mA
  • 同步整流:否(需外接肖特基整流二极管)
  • 工作温度:-40℃ ~ +125℃
  • 输出通道:单通道

三、关键特性

  • 高效率:在中高电流输出下效率优越,减少系统发热和能耗。
  • 低静态电流:约2mA的待机电流,有利于降低空载损耗。
  • 可调输出:通过外置电阻分压实现宽范围输出电压调整,满足多种整机电压需求。
  • 内置开关管:简化外部器件选型和PCB布局,但需外接肖特基二极管进行续流。
  • 工作频率适中:150kHz有利于在效率与外部元件体积之间取得平衡,允许使用体积适中的电感与电容。

四、典型应用

  • 汽车电子 12V/24V -> 5V/3.3V 点对点供电
  • 工业控制与嵌入式主板供电
  • 通信设备、仪器仪表的功率模块
  • 电池供电系统的降压管理

五、设计与布局建议

  • 外部肖特基二极管:需选用≥3A、反向耐压高于输入电压的低压降肖特基。
  • 电感选择:建议饱和电流高于输出峰值、低DCR 的功率电感。根据开关频率与期望电流纹波,按公式选择 L:L = (Vin - Vout) * Vout / (Vin * ΔIL * f),其中 ΔIL 可取输出电流的20%~40%。
  • 电容选型:输入侧选用低ESR电解或钽并联陶瓷,输出侧优先低ESR固态/陶瓷以提高稳定性与瞬态性能。
  • PCB 布局:开关节点回路尽量短且宽,输入电容靠近器件输入引脚,肖特基与输出电感回路紧凑布线以减小辐射与环路面积。接地采取单点或大平面,利于散热与EMI控制。

六、热管理与可靠性

在接近3A输出或较高输入-输出压差时器件产生的功耗显著,建议:

  • 采用大铜箔散热或在器件下方开窗并使用热过孔向背面散热。
  • 在高环境温度下降额使用或考虑外加散热片/风扇。
  • 做好短路保护、过温保护(若外围需要)以及上电启动顺序管理以提升可靠性。

七、使用注意事项

  • 由于为非同步整流结构,肖特基二极管的损耗在高电流下影响明显,设计时需考虑其功耗与热量。
  • 调整输出时请根据基准电压的容差(约1.193V~1.267V)计算外部分压器阻值以保证精度。
  • 完整评估输入瞬态、输出负载突变对环路稳定性的影响,必要时调整补偿与输出滤波参数。

如需参考典型外部元件清单、具体补偿网络值或根据具体输入/输出条件计算电感与电容值,我可以基于目标工况给出详细选型与示例电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.