Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Slkor BZT52B3V3BS
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Slkor BZT52B3V3BS
- Type
- SLKOR
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SLKOR
- Electronic Component
- BZT52B3V3BS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0g
- Electronic Component
- 89Ω
- Electronic Component
- 1
- Electronic Component
- BM0003909112
- Current(Ir)
- 4.5uA@1V
- Power Dissipation(Pd)
- 400mW
- Electronic Component
- 3.23V~3.37V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Electronic Component
- 3.3V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52B3V3BS 产品概述
概述
BZT52B3V3BS是一款由Slkor（萨科微）生产的稳压二极管，属于Zener二极管系列。该二极管具有良好的稳压特性，主要用于电路中的电压稳压保护和电源管理。其稳压电压为3.3V，具有3.23V至3.37V的稳定电压范围，能够有效防止电压波动对敏感电子元件造成的损害。
主要特性
稳压特性：BZT52B3V3BS在电压稳定性方面表现出色，3.3V的稳压特性使其适用于多种应用场合，如电源供给、信号调理和保护电路等。其稳压幅度可在3.23V到3.37V之间微调，为用户提供了一定的灵活性，以适应不同的需求。
功率处理能力：该稳压二极管的最大功耗为400mW，能够在较大功率的条件下可靠工作，适合用于不同行业和场景。
低反向饱和电流：在1V反向偏压条件下，BZT52B3V3BS的反向饱和电流仅为4.5μA，这意味着在正常工作状态下，二极管的漏电流很低，有助于提高电路的整体效率，降低功耗。
紧凑封装：BZT52B3V3BS采用SOD-323封装，体积小且易于在PCB布局中集成。这种封装形式特别适合空间有限的设计需求，如便携设备、嵌入式系统等。
应用场景
BZT52B3V3BS的优异性能使其在多个领域都有广泛应用：
电源保护：在电源电路中使用BZT52B3V3BS可以有效地保护下游组件免受电压尖峰或过电压的影响，确保系统的稳定性。
信号调理：在模拟信号传输线路中，使用该稳压二极管可以平滑信号波动，避免因电压不稳导致的数据错误。
便携式设备：由于其小巧的SOD-323封装，BZT52B3V3BS特别适合移动设备、传感器和其他需要高度集成的电路设计。
LED驱动电路：在LED照明系统中，BZT52B3V3BS能够提供必要的电压稳压，确保LED在稳定亮度下工作，提高其使用寿命。
性能曲线
在具体设计中，设计师可以参考BZT52B3V3BS的温度特性曲线和稳压性能图，选择合适的工作条件以及负载，从而达到最佳性能。这些图表通常在产品数据手册中提供，能够帮助设计师更好地理解该元件的工作特性。
结论
BZT52B3V3BS作为一款高性能的稳压二极管，通过其卓越的电压稳压能力、低漏电流和小型化封装，为现代电子电路设计提供了可靠的解决方案。无论是在电源管理、信号调理还是作为电路保护元件，该产品都能展现出其独特的优势，是电子设计工程师值得选用的优质元器件。对于追求高效、稳定和小型化设计的应用场合，BZT52B3V3BS无疑是一个理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
