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Slkor BZT52B13S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Slkor BZT52B13S
- Type
- SLKOR
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SLKOR
- Electronic Component
- BZT52B13S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- (Zzk)
- 170Ω
- (Zzt)
- 30Ω
- Electronic Component
- BM0264386323
- Diode
- 1
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 12.74V~13.26V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52B13S 产品概述
一、产品简介
BZT52B13S 是 Slkor（萨科微）推出的一款小功率、通用型稳压二极管，采用平面芯片结构并封装于 SOD-323 小封装中。器件为独立式单个二极管，标称稳压值为 13V，适用于需要稳压基准或低功耗基准电源的应用场景，同时提供无铅（RoHS）版本，便于自动化组装与环保合规。
二、主要电气参数
- 标称稳压值 Vz：13V（典型范围 12.74V ~ 13.26V）
- 反向电流 Ir：100nA（典型/测试条件下）
- 耗散功率 Pd：200mW（封装极限）
- 稳态阻抗 Zzt：30Ω（在规定测试电流下的动态阻抗）
- 膝部阻抗 Zzk：170Ω（低电流区域的阻抗特性）
- 工作结温范围：-55℃ ~ +150℃
注：在最大耗散功率条件下的最大稳压电流约为 Pd/Vz ≈ 15.4mA，实际电流应根据散热与PCB环境做降额设计。
三、结构与工艺特点
本器件采用平面芯片结构，具有温度特性稳定、参数一致性好等优点；SOD-323 封装尺寸小、引脚短、热阻较低，适合高速贴装与回流焊工艺。提供无铅版本，满足现代电子制造的环保与可靠性要求。
四、优势与应用场景
- 优势：体积小、固有阻抗低、温度范围宽、参数一致性好，适合自动化组装流程。
- 典型应用：小型稳压源、参考电压、浪涌吸收与保护、偏置稳定、低功耗便携设备、传感器前端与模拟电路基准等。
五、设计与使用建议
- 耗散功率与散热：在高环境温度或散热条件差的 PCB 上，应降低工作电流以避免超过 200mW 的耗散限值；可通过串联限流电阻或增加散热铜箔来改善。
- 动态阻抗：在对噪声和稳压精度要求高的设计中，应考虑 Zzt 对稳压精度的影响，并在必要时采用滤波或并联稳定元件。
- 反向电流与漏电：Ir 为 100nA 量级，适合低泄漏要求的电路；但高温下漏电会增加，设计时需注意温度漂移对静态电流的影响。
- 封装与装配：SOD-323 兼容常见贴片制程，建议遵循厂家的回流曲线与焊盘建议以保证可靠焊接。
六、选型与采购提示
选型时请确认稳压值容差、工作电流范围以及环境温度条件是否满足设计要求；若需严格的精度或更高功耗能力，可考虑更大封装或高功率系列。Slkor（萨科微）提供标准与无铅版本，可在订购时注明所需版本与批次信息。
总结：BZT52B13S 以其稳定的 13V 基准、紧凑的 SOD-323 封装与良好的自动化适配性，适合多种中低功率稳压与参考电路，设计时注意耗散功率与热管理可确保器件长期可靠运行。
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