WMSIC Electronic Components

Siproin H8118A50M5R

ModelH8118A50M5R
PackageSOT-23-5
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin H8118A50M5R
Type
SIPROIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
H8118A50M5R
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.023g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265610095
Operating Temperature
40℃~+85℃
Operating Voltage
2.1V~5.5V
Switching Frequency
300kHz
Electronic Component
Electronic Component
Output Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H8118A50M5R DC-DC升压电源芯片产品概述

一、产品定位与核心价值

H8118A50M5R是上海矽朋(Siproin)推出的超小封装同步升压DC-DC电源芯片,专为低输入电压场景下的固定5V输出需求设计。其核心价值在于:在SOT-23-5超小封装内集成同步整流电路与功率开关管,兼顾高效率、宽输入范围、宽温可靠性,同时大幅简化外围电路,是便携电子、小型传感器节点等场景的理想电源解决方案。

二、核心性能参数详解

1. 输入输出特性

  • 输入电压:2.1V~5.5V,覆盖主流低电压场景:
    • 单节锂电池(2.4V~4.2V,含低电量状态);
    • 2节干电池(3V);
    • 5V USB辅助供电(冗余场景)。
  • 输出电压:固定5V,无需外部反馈电阻设定,简化设计的同时保证输出精度(典型±2%),适配USB设备、小型MCU、传感器模块等5V负载。

2. 效率与整流方案

采用同步整流拓扑(内置同步整流管),相比异步整流(外接肖特基二极管),可将转换效率提升至90%以上(典型负载100mA~500mA),减少功耗与发热;内置主开关管+同步整流管,无需外接功率器件,进一步缩小系统体积。

3. 开关频率与EMI

固定300kHz开关频率,处于常规开关电源的“低EMI区间”,配合合理PCB布局可有效抑制电磁干扰;同时无需使用极小值电感(避免电感饱和问题),降低BOM成本。

4. 宽温可靠性

工作温度范围为**-40℃~+85℃,满足工业级环境与消费电子的宽温需求(如户外传感器、车载小设备、低温地区便携产品);芯片内部集成过温保护(OTP)**,温度过高时自动关断,保障长期稳定运行。

5. 封装与引脚

采用SOT-23-5超小封装(尺寸约2.9mm×2.5mm×1.1mm),节省PCB空间(比常见SOT-23-6封装更小);引脚功能清晰(VIN、GND、EN、SW、VOUT),外围仅需电感、输入输出电容即可工作。

三、典型应用场景

H8118A50M5R的参数特性使其适配以下场景:

  1. 便携电子设备:单节锂电池供电的TWS耳机充电盒(输入3.7V→输出5V给耳机充电)、智能手环/手表的应急5V输出、蓝牙音箱的电源升压;
  2. 小型传感器节点:2节干电池(3V)供电的温湿度传感器、光照传感器、气体传感器(需5V驱动模块);
  3. 低电压电源扩展:旧锂电池(电量低至2.1V)的升压转换、USB输入(5V)下的稳定5V输出(冗余供电);
  4. 工业小型设备:-40℃~+85℃环境下的低功耗控制模块、户外监测设备的电源单元。

四、外围电路设计注意事项

因内置核心功率器件,外围电路仅需3类元件,设计极简:

  1. 电感选择:推荐10μH~22μH功率电感(如CDRH3D16-10μH),饱和电流需≥1.5A(适配最大输出电流,需参考 datasheet 具体值),电感需靠近SW引脚放置;
  2. 电容选择:
    • 输入电容:10μF X7R陶瓷电容(-40℃~+85℃稳定),靠近VIN与GND引脚;
    • 输出电容:22μF X7R陶瓷电容,靠近VOUT与GND引脚,减少输出纹波(典型纹波<50mV);
  3. EN引脚:可通过MCU或开关控制芯片使能(高电平有效),实现电源休眠管理,静态功耗低至<1μA(典型值)。

五、总结

H8118A50M5R作为一款高集成度同步升压芯片,以SOT-23-5超小封装实现了宽输入范围、高效率、宽温可靠的性能,外围电路极简,是便携电子、小型传感器等场景的高性价比电源解决方案。上海矽朋的工业级设计保证了其在恶劣环境下的稳定运行,适配多种低电压输入场景的5V输出需求,有效降低系统开发成本与体积。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.